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Quality and Reliability - Failure Analysis Capabilities
Electrical Characterization & Failure Site Localization Microstructure & Tiny Defect Analysis Material, Surface & Interface Analysis
Electrical Characterization & Failure Site Identification
Scanning Acoustic Microscopy (C-SAM)
Mos-Aid Memory Testing (Bit Mapping)
Navigation & CAD Tools for Circuit Layout Tracing
E-Beam Testing & Microcircuit Isolation
Front Side & Back Side Emission Microscopy (EMMI)
Front Side & Back Side IR Emission Microscopy (IR-EMMI)
Optical Beam Induced Resistance Change (OBIRCH)
Voltage Contrast (VC)
Resistive Contrast Imaging (RCI)
Time Domain Reflectometry (TDR)
Nano probing system for transistor level diagnosis
X-Ray for non-invasive package/assembly analysis