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台積電文教基金會
聯絡我們
高階主管
張忠謀
董事長
學歷:
美國史丹福大學電機工程博士
經歷:
本公司總執行長、工業技術研究院董事長、美國通用器材公司總裁
Dr. Morris Chang is the founding Chairman of Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), one of the largest semiconductor companies in the world. Dr. Chang founded TSMC in 1987, and pioneered the dedicated silicon foundry business model. TSMC has served as a powerful force in building the fabless and fab-lite semiconductor industry, which in turn became TSMC’s customer base.

Prior to his career in Taiwan, Dr. Chang's career was in the United States. He was the President and Chief Operating Officer of General Instrument Corporation from 1984-1985, and prior to that, he served at Texas Instruments for 25 years (1958-1983), where he was Group Vice President responsible for worldwide semiconductor business for six years, and Group Vice President responsible for worldwide consumer products business for three years.

Dr. Chang attended Harvard University in his freshman year (1949-1950), received his B.S. and M.S. degrees in Mechanical Engineering from M.I.T. in 1952 and 1953, and his Ph.D. in Electrical Engineering from Stanford in 1964 while on full-pay leave from T.I.. He has received honorary doctorates from eight universities.

Dr. Chang is a Member of National Academy of Engineering (U.S.A.), a Life Member Emeritus of MIT Corporation, Fellow of the Computer History Museum, and Honorary Chairman of Taiwan Semiconductor Indsutry Assoication (TSIA).

Dr. Chang received many awards in his career. Among them were: IEEE Medal of Honor (2011), IEEE Robert N. Noyce Medal (2000), SIA(US) Robert N. Noyce Award (2008), Exemplary Leadership Award of Global Semiconductor Association (1999), ROC Order of the Brilliant Star (2011), Nikkei Asia Prize (2005), Stanford Engineering Hero (2014), Laureate of ITRI (Taiwan, 2012), EE Times Lifetime Achievement Award (2009), Visionary Award from SPIE (2014), 30 Best CEO’s (Barron’s 2013), Businessman of the Year (Forbes Asia, 2012), SEMI Akira Inoue Award for green management (2011), etc.
曾繁城
副董事長
學歷:
國立成功大學電機工程博士
經歷:
本公司總經理、世界先進積體電路公司總經理
Dr. F.C. Tseng is the Vice Chairman of TSMC. Prior to his appointment, Dr. Tseng served as Deputy Chief Executive Officer, President, and Senior Vice President of Operations. Dr. Tseng also spent two years as President of Vanguard International Semiconductor Corporation (VIS), which spun out from the Industrial Technology Research Institute's (ITRI) Sub-micron Process Technology Development Project and was Taiwan's first eight-inch IC facility.

Dr. Tseng led 110 specialists to spin off from ITRI's Electronics Research & Service Organization (ERSO), and in 1987 co-founded TSMC as a pioneer specializing in the "foundry only" semiconductor manufacturing business. Dr. Tseng established a solid technical base for TSMC's six-inch and eight-inch fabs.

From 1973 to 1986, Dr. Tseng served at ITRI-ERSO. In 1978, Dr. Tseng was promoted to plant manager of the IC demonstration plant, where he was responsible for the production and development of silicon-gate CMOS. Under his supervision, ITRI established the capability to develop an advanced CMOS process.

Dr. Tseng holds a Ph.D. degree in electrical engineering from National Cheng Kung University in Taiwan, and he was named one of the "Ten Outstanding Engineers" by the Chinese Institute of Engineers in 1991.
劉德音
總經理暨共同執行長
學歷:
美國加州大學柏克萊分校電機暨電腦資訊博士
經歷:
本公司共同營運長、營運資深副總經理、先進技術事業資深副總經理、南廠區副總經理、世大積體電路製造公司總經理
Dr. Mark Liu is currently President and Co-CEO at TSMC. Prior to assuming this post, he was Co-Chief Operating Officer from March 2012 to November 2013. Before that, he was Senior Vice President of Operations from 2009 to 2012. From 2006 to 2009, he was a Senior Vice President responsible for the Advanced Technology Business at TSMC. He served in a number of executive positions at TSMC Fabs and the Operations organization from 2000 to 2006, and from 1999 to 2000, he was President of Worldwide Semiconductor Manufacturing Corp.

Prior to joining TSMC, from 1987 to 1993, he was with AT&T Bell Laboratory, Holmdel, NJ, as a research manager for the High Speed Electronics Research Laboratory, working on optical fiber communication systems. From 1983 to 1987, he was a process integration manager of CMOS technology development at Intel Corporation, Santa Clara, CA, developing silicon process technologies for Intel microprocessors.

Mark Liu received B.S. degree in electrical engineering from National Taiwan University. He received M.S. and Ph.D. degrees in electrical engineering and computer science from University of California, Berkeley.
魏哲家
總經理暨共同執行長
學歷:
美國耶魯大學電機工程博士
經歷:
本公司共同營運長、業務開發資深副總經理、主流技術事業資深副總經理、南廠區營運副總經理、 新加坡特許半導體公司資深副總經理
Dr. C. C. Wei joined TSMC in 1998 and currently serves as President and Co-Chief Executive Officer. Prior to his recent appointment, Dr. Wei was TSMC's Co-Chief Operating Officer from March 2012 to November 2013. From 2009 to 2012, he was TSMC’s Senior Vice President of Business Development. Before that, he was Senior Vice President of Main Stream Technology Business.

Before joining TSMC, he was Senior Vice President of Technology at Chartered Semiconductor and Senior Manager, Logic and SRAM technology development at ST Microelectronics.

C. C. Wei received B.S. degree in electrical engineering from National Chiao Tung University. And later he was awarded his PhD by Yale University.
左大川
資訊技術資深副總經理暨資訊長
學歷:
美國加州大學柏克萊分校材料科學暨工程博士
經歷:
本公司美國WaferTech子公司總經理、本公司營運組織資深副總經理
Dr. Steve Tso is TSMC's Senior Vice President and Chief Information Officer. Prior to his current position, Dr. Tso served as President of TSMC's Wafertech affiliate in Camas, Washington.

Dr. Tso joined TSMC in 1996 as the Vice President of R&D. He was later the Senior Vice President of World Wide Marketing & Sales and Vice President of Operations. Prior to joining TSMC, Dr. Tso served as General Manager of Applied Materials CVD products, Vice President of Operations at SGS-Thomson and as a Fab Manager for Texas Instruments.

Dr. Tso received the B.S. degree in Physics from National Taiwan University and his M.S. and Ph.D degrees in Materials Science and Engineering from University of California, Berkeley.
何麗梅
財務資深副總經理暨財務長兼發言人
學歷:
國立台灣大學商學碩士
經歷:
本公司副總經理暨財務長兼發言人、德皏b導體公司副總經理暨財務長
Lora Ho is the Chief Financial Officer and Spokesperson of Taiwan Semiconductor Manufacturing Company Limited (TSMC).

Joined TSMC in 1999, Ms. Ho served as Corporate Controller from 1999 to 2003, and became the Chief Financial Officer since 2003. Prior to TSMC, Ms. Ho served various positions in Accounting and Finance field in Foreign invested companies.

Ms. Ho was awarded " Outstanding Financial Executive " for the year of 1993 by Financial Executives Institute, The " Best Companies' Best CFO " of Taiwan from 2007-2010 by FinanceAsia , also the Best CFO in Asia in 2011 by Institutional Investor.

Ms. Ho received her MBA degree from National Taiwan University in 2003 and a B.A. degree from National Cheng-chi University in 1978.
羅唯仁
研究發展 / 技術發展資深副總經理
學歷:
美國加州大學柏克萊分校固態物理及表面化學博士
經歷:
本公司營運/製造技術副總經理、先進技術事業副總經理、研究發展副總經理、營運組織二副總經理、美商英特爾公司CTM廠長暨先進技術發展協理
Dr. Lo is TSMC's Senior Vice President of Research and Development. Prior to this post, he served as Vice President of the Company's Advanced Technology Business.

Dr. Lo joined TSMC in 2004 as Vice President of Operations II and served as Vice President of Research & Development from 2006 to 2009.

Prior to joining TSMC, Dr. Lo was Director of Technology Development and Plant Manager with Intel Corporation's Technology and Manufacturing Group. From 1997 to 2000, he served a Factory Manager, responsible for running Intel's development factory in Santa Clara, California.

Dr. Lo has also worked at U.S. university, the Motorola Research and Development Lab and the Xerox Microelectronics Center.

Dr. Lo received his B.S. degree in physics from National Taiwan University and his M.S. and Ph.D. degrees in Solid State Physics and Surface Chemistry from University of California, Berkeley.
Rick Cassidy
資深副總經理暨美國子公司執行長
學歷:
美國西點軍校工程學位
經歷:
台積電美國子公司客戶管理副總經理
Mr. Cassidy’s electronics career began at Fairchild Semiconductor, later acquired by National Semiconductor. Over an 18-year span he rose through manufacturing, engineering, quality and reliability, and marketing, culminating with his appointment as Vice President and General Manager of National’s Military & Aerospace Division and Co-Chair of National’s General Manager Council.

He joined TSMC North America in 1997 as Vice President of Account Management; promoted to President, TSMC North America in 2005; elected Corporate Vice President, TSMC, Ltd. in 2008; and elected Senior Vice President, TSMC, Ltd. in 2014. Over nearly two decades at TSMC he has helped lead the company to record growth, while contributing greatly to the success of the fabless semiconductor business model. He currently serves on the Global Semiconductor Alliance (GSA) Board of Directors, an organization dedicated to the advancement of the worldwide semiconductor industry.

Prior to entering the semiconductor industry, Mr. Cassidy served as an officer in the U.S. Army. He holds a Bachelor of Science degree in Engineering from the United States Military Academy at West Point.
秦永沛
營運 / 產品發展資深副總經理
學歷:
國立成功大學電機工程碩士
經歷:
本公司生產組織/ 產品發展副總經理
Mr. Y.P. Chin was promoted to Sr. Vice President in November 2016. Prior to this post, Mr. Chin served as TSMC's Vice President of Operations for Product Development. Prior to this, he was Vice President of Advanced Technology Business in TSMC, sharing responsibility with Senior Vice President Dr. Mark Liu for TSMC's advanced technology and 300mm fab operations.

Mr. Chin joined TSMC when it was founded in 1987 and has made significant contribution to TSMC's product engineering capability throughout his career. He was Director of Fab 1 from 1997 to 1998, and in later positions helped manage yield improvement in all new generations of advanced technology, including 0.13-micron, 90nm, 65nm, and 45nm nodes. Mr. Chin pioneered the development of TSMC's Golden Spice Modeling methodology and Design For Manufacturing program.

Prior to joining TSMC, Mr. Chin worked as an engineer with the Industrial Technology Research Institute's Electronics Research and Service Organization (ERSO-ITRI).

Mr. Chin earned his B.S. and M.S. degrees in Electrical Engineering from National Cheng Kung University.
米玉傑
研究發展 / 技術發展資深副總經理
學歷:
美國洛杉磯加州大學電機工程博士
經歷:
本公司研究開發組織 / 技術發展副總經理
Dr. Y.J. Mii was promoted to Sr. Vice President in November 2016. Prior to this post, Dr. Y.J. Mii served as TSMC's Vice President of Research and Development (R&D) since 2011. He joined TSMC in 1994 and has been involved continuously in the development and manufacturing of advanced CMOS technologies in both Fab Operation and R&D. Dr. Mii joined R&D in 2001, managing both 90nm and 40nm technology development. Following that he began supervising 28nm technology development, accelerating it to lead the foundry industry.

Dr. Mii was a research staff member at IBM Research before joining TSMC. He joined TSMC as a deputy manager of Fab 3 engineering, eventually rising to senior director of R&D before being promoted.

He holds a B.S. in electrical engineering from National Taiwan University, as well as an M.S. and Ph.D. in Electrical Engineering from the University of California, Los Angeles (UCLA).
曾孟超
營運 / 協力廠副總經理
學歷:
中原大學應用化學研究所碩士
經歷:
本公司主流技術事業副總經理、營運組織一副總經理、二廠協理
Mr. M.C. Tzeng is TSMC's Vice President of Operations for Affiliate Fabs. Prior to this post, he served as Vice President of TSMC's Mainstream Technology Business. He joined the Company in 1987.

Prior to TSMC, Mr. Tzeng worked for ERSO/ITRI on IC process technology projects. Mr. Tzeng has compiled an extensive IC manufacturing background having held positions as a Process Engineer, Fab Section Manager, Fab Department Manager and Fab Senior Director. His in-depth knowledge covers both on process technology development and Fab operations.

Mr. Tzeng received his B.S. degree in Chemistry from Tamkang University and his M.S. degree in Applied Chemistry from Chung Yuan University.
孫元成
研究發展 / 技術研究副總經理暨技術長
學歷:
美國伊利諾大學電機工程博士
經歷:
本公司研究發展副總經理
本公司邏輯技術發展處協理,資深處長
美國國際商用機器公司(IBM)研發部門
Dr. Jack Sun has served as TSMC's Vice President of Research and Development since June of 2006 and as Chief Technology Officer since November 2009. During his career at TSMC, he has led the successful expansion and acceleration of the logic and Mixed-signal/RF technology roadmap and driven the development of advanced technology initiatives from the 0.18-micron node to today's leading edge 28nm process.

Prior to joining TSMC, Dr. Sun held a number of senior management and engineering positions at IBM Research and the IBM Semiconductor Research and Development Center for 14 years. He led many successful R&D projects that set world records and shaped industry trends in CMOS, SOI, low-power CMOS, low temperature CMOS, bipolar, and SiGe Hetero-junction Bipolar Transistors (HBT).

Dr. Sun received his BS degree from National Taiwan University, and MS and Ph.D. degree from the University of Illinois, all in Electrical Engineering. He is an IEEE Fellow in recognition of his significant contributions to CMOS technology. He has over 200 papers, 11 US patents, and several ROC patents.
蔡能賢
品質暨可靠性副總經理
學歷:
美國麻省理工學院材料工程博士
經歷:
本公司品質暨可靠性處資深處長
Dr. N.S. Tsai, TSMC Vice President of Quality and Reliability, joined the company in 1989. As head of Quality and Reliability since 2004, Dr. Tsai has led the successful customer qualification of 90nm, 80nm, and 65nm technologies.

Over his career at TSMC, Dr. Tsai has a wide variety of positions in R&D, Operations, and Assembly & Testing. He was director of Fab 1 from 1993 to 1995, and served as director of Fab 4 from 1995 to 1997, where he established standard quality systems that made Fab 4 an outstanding manufacturing facility as well as TSMC's R&D development fab for several technology generations.

Dr. Tsai also established TSMC's first 12-inch pilot line and was responsible for evaluating and selecting production tools, developing automated manufacturing systems, and transitioning from eight-inch to 12-inch production. He also developed TSMC's flip chip technology and established TSMC's first 12-inch wafer bumping line when he was the head of Assembly & Test.

Before joining TSMC, Dr. Tsai served with AT&T's R&D department for 5 years.

Dr. Tsai earned his B.S. in Physics from National Tsinghua University, his M.S. degree in Physics from Temple University and his Ph.D. in Materials Science from Massachusetts Institute of Technology.
林錦坤
營運 / 六吋及八吋廠副總經理
學歷:
國立彰化師範大學工業教育與技術學系學士
經歷:
本公司成熟技術事業總廠長、十二廠廠長、六廠廠長及三廠廠長
Mr. J.K. Lin is TSMC'sVice President of Operations for Mainstream Fabs. Prior to this post, Mr. Lin served as Senior Director of Mainstream Fabs.

Mr. Lin joined TSMC when it was founded in 1987 and has held a number of manufacturing positions including Equipment Engineer, Section Manager, and Department Manager in Fab1 and 2. He was responsible for the construction of Fab 3 was later Fab Director of Fab 3, Fab 7, Fab 6, Fab 12, and Senior Director for 300mm Fabs. He worked in the Electronic Research and Service Organization (ERSO) of Taiwan's Industrial Technology Research Institute (ITRI) before joining TSMC.

Mr. Lin earned his B.S. degree from National Changhua University of Education.
王建光
營運 / 十二吋廠副總經理
學歷:
國立成功大學化學工程碩士
經歷:
本公司十二吋廠總廠長、六吋暨八吋總廠長
J. K. Wang received his B.S. and M.S. degrees in chemical engineering from National Cheng-Kung University in 1981 and 1983 respectively. He is currently Vice President of Operations for 300mm fabs. Prior to this post, he was the senior director of 300mm fab operations.

J. K. Wang has served at TSMC since the company was founded in 1987. During his career with TSMC, he has been involved in many different aspects of the company's operations, including module engineering, process integration, R&D technology development, manufacturing, and fab management. Previously, he had been the fab director of Fab4, Fab3, Fab14 and senior director of 6" and 8" fab operations.

J. K. Wang has been deeply involved in building up TSMC's manufacturing technology and systems, particularly fab automation and manufacturing infrastructure. He currently serves as TSMC's representative on the International SEMATECH Manufacturing Initiative (ISMI) Executive Advisory Committee for next generation fabs.
孫中平
企業規劃組織副總經理
學歷:
美國康乃爾大學材料科學暨工程博士
經歷:
本公司企業規劃組織協理、美商國際商用機器公司(IBM)科技事業群台灣總經理
Dr. Irene Sun is currently TSMC's Vice President Corporate Planning. Prior to this post, she was Senior Director of the Corporate Planning Organization. She joined TSMC in October 2003 as Director of the Corporate Pricing Division.

Prior to TSMC, Dr. Sun worked at IBM for 23 years and held a variety of management positions in R&D, Manufacturing Engineering, Marketing & Sales, and Business Management.

Dr. Sun received her B.S. degree in Nuclear Engineering from National Tsinghua University in Taiwan, and her Ph.D. in Materials Science and Engineering from Cornell University.
侯永清
研究發展 / 設計暨技術平台副總經理
學歷:
美國紐約雪城大學電機博士
經歷:
本公司設計暨技術平台組織資深處長、工研院電通所前端設計流程研發
Dr. Cliff Hou was appointed TSMC's Vice President of Research and Development (R&D) in 2011. Dr. Hou joined TSMC in 1997. He was previously Senior Director at Design and Technology Platform where he established the Company's technology design kit and reference flow development organizations. Dr. Hou also led TSMC in-house IP development teams from 2008 to 2010.

Prior to joining TSMC, Dr. Hou was in front-end design environment development with the Computer & Communications Research Laboratories, Industrial Technology Research Institute (ITRI/CCL) in Taiwan; worked as a section manager specializing in physical verification methodologies; and served as an Associate Professor at Kaohsiung Polytechnic Institute, Taiwan.

Dr. Hou received National Manager Excellence Award in 2010. He led the company's Open Innovation Platform® (OIP) project team to win First National Industry Innovation Award in 2011 by the Ministry of Economic Affairs (MOEA), Taiwan.

Dr. Hou holds 46 U.S. Patents and serves as a member of Board of Directors in Global Unichip Corp. He received his B.S. degree in Control Engineering from Taiwan's National Chiao-Tung University, and his Ph.D. in Electrical and Computer Engineering from Syracuse University.
金平中
業務開發副總經理
學歷:
美國南加州大學化學博士
經歷:
本公司業務開發組織長、上海宏力半導體公司研發副總、 美商英特爾技術研發處長
Dr. BJ Woo is Vice President of Business Development at TSMC, having been appointed to that position in November 2013. Prior to that, she served as Director of TSMC's Business Development Division, heading that organization since March, 2013. Dr. Woo joined TSMC as Senior Director of the Advanced Technology Marketing Division in April 2009, where she was responsible for the advanced technology roadmap and technology definition for the 28/20 nm process technology that targeted high performance and low power applications.

Prior to joining TSMC, BJ spent most of her career at Intel Corporation where she held various senior manager positions in the technology development group. She owns 13 patents and was nominated by Intel to enter the Hall of Fame for WITI (women-in-technology-international) in 2006.

BJ received her B.S. degree from National Taiwan University and her PhD from University of Southern California.
方淑華
法務副總經理暨法務長
學歷:
愛荷華大學比較法學碩士
經歷:
本公司副法務長、公司法務處處長、台灣國際專利法律事務所 資深律師
Sylvia Fang was appointed Vice President and General Counsel for TSMC in August, 2014. Previously, she served as Associate General Counsel, heading that organization since February, 2014. Sylvia joined TSMC in 1995. She was previously Director at Corporate Legal Division where she worked on numerous high-profile corporate transactions, precedent-setting intellectual property trade secret litigations, the promotion of significant legal changes and the resolution of corporate governance issues. She also has been working extensively with the Board of Directors, including the independent directors on various Board, Audit Committee and Compensation Committee matters and other special projects.

Prior to her career at TSMC, Sylvia worked at a leading boutique intellectual property law firm (TIPLO) where she developed her expertise on general corporate and IP issues.

The global legal community recognized Sylvia’s achievement in 2005 when the leading publication Asialaw magazine awarded her the “2005 Deep & Far Award for Taiwan In-House Counsel”. She is also known among key government trade, commerce and securities law administrative agencies due to her relations cultivated over the years of promoting important legal changes to support corporate goals.

Sylvia is an attorney admitted in Taiwan having received her LL.B. degree from National Taiwan University, and her M.C.L. from School of Law, University of Iowa.
馬慧凡
人力資源副總經理
學歷:
國立台灣大學國際企業管理碩士
經歷:
本公司人力資源組織長 、趨勢科技人力資源資深副總經理
Connie Ma has been appointed as Vice President of Human Resources since August 2014.  She joined TSMC in June 2014 as Director of Human Resources.

Connie has over 30 years of HR experience.  Prior to joining TSMC, she held several senior HR managerial positions at Trend Micro Inc., NCR Corporation and AT&T Corporation.  Connie was Senior Vice President of Global Human Resources at Trend Micro where she led corporate transformation by building a global HR team to enhance the execution of corporate strategy and culture in terms of realigning organization structure, strengthening global collaboration and facilitating employee engagement.

Connie holds an EMBA from National Taiwan University and a bachelor's degree in business administration from Soochow University.
王英郎
研究發展 / 技術發展副總經理
學歷:
國立交通大學電子工程博士
經歷:
南科十四B廠資深廠長
Dr. YL Wang was appointed TSMC's Vice President of Technology Development (TD) in October 2015. Prior to this post, Dr. Wang served as Senior Director of Fab 14B.

Dr. Wang joined TSMC in 1992 and has been deeply involved in building TSMC’s manufacturing technology and methodology. During his 20+ years career, he successfully contributed to mass-production of the company's 0.35-micorn, 0.25-micorn, 0.18-micorn, 0.13-micorn, 90nm, 65nm, 40nm, 20nm and 16nm process technologies, providing significant productivity improvement and defect density enhancement.

Dr. Wang received his B.S. degree in Physics from National Tsing Hua University; his M.S. degree in Materials Science from National Sun Yat-Sen University and Ph.D. in Electrical Engineering and Computer Science from the National Chiao Tung University. He has 109 US patents, and over 100 Republic of China, Peoples Republic of China ,and French patents.
余振華
研究發展 / Integrated Interconnect & Packaging副總經理
學歷:
美國喬治亞理工學院材料工程博士
經歷:
本公司研究開發組織 Integrated Interconnect & Packaging 處資深處長
Dr. Doug Yu was appointed TSMC's Vice President in November 2016. Dr. Yu joined TSMC in 1994. He was previously Senior Director of the Integrated Interconnect & Packaging Division, where he led the development of interconnect technology for integrated circuits.

Dr. Yu received his B.S. degree in Physics and M.S. degree in Materials Science and Engineering both from National Tsing Hua University, and his Ph.D. in Materials Engineering from Georgia Institute of Technology. In 2013, he was elevated to IEEE fellow grade.
Alexander Kalnitsky
台積科技院士、研究發展 / 特殊技術副總經理
學歷:
加拿大卡爾頓大學電機工程博士
經歷:
本公司研究開發組織特殊技術處資深處長
Dr. Alexander Kalnitsky was appointed TSMC's Vice President in November 2016. Prior to this appointment, Dr. Kalnitsky served as a Senior Director of the More-than-Moore Technologies Division.

Dr. Kalnitsky joined TSMC in 2009. At TSMC, he is a well-respected technical leader with an excellent track record in HV/Power/Analog/RF/CIS/MEMS processes development. He was elected a TSMC Fellow in 2013.

Prior to joining TSMC, Dr. Kalnitsky worked for over 30 years in the semiconductor industry at companies such as Intersil, Maxim Integrated Product, National Semiconductor, STMicroelectronics and Northern Telecom

Dr. Kalnitsky received his M.S. degree in Applied Sciences from the University of Toronto, Canada and Ph.D. in Electrical Engineering from Carleton University, Canada. He authored or co-authored over 140 issued U.S. patents (over 20 invention disclosures filed while at TSMC). Alex has over 120 publications in technical journals and conference presentations.
張曉強
研究發展 / 設計暨技術平台副總經理
學歷:
美國杜克大學電機工程博士
經歷:
美商英特爾公司技術與製造副總經理
Dr. Kevin Zhang currently serves as Vice President of Design and Technology Platform where he is responsible to advanced memories, analog, mixed-signal, and RF circuits and IP development. Prior to joining TSMC in November 2016, he was Vice President of Technology and Manufacturing Group and Director of Circuit Technology at Intel, where he was responsible to the development of process design rules, circuit & device modeling, digital libraries, key analog and mixed-signal circuits. He led the development of embedded memory technologies from 90nm to 10nm at Intel, including SRAM, eDRAM, eFuse and future memories. He was also responsible to the design and validation of lead vehicles for process technology development at Intel. Dr. Zhang was elected as Intel Fellow in 2005 and led his teams to win 5 Intel Achievement Awards, the highest technical accomplishments at the company.

Dr. Zhang has published more than 80 papers at international conferences and in technical journals and is the editor of Embedded Memory for Nano-Scale VLSIs, published by Springer in 2009. He holds 55 U.S. patents in the field of integrated circuit technology. Dr. Zhang was the 2016 International Solid-State Circuit Conference (ISSCC) Program chair and serves on IEEE VLSI Executive Committee. He is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE). He received his bachelor's degree from Tsinghua University in Beijing and his Ph.D. from Duke University, both in electrical engineering.

子公司高階主管
 
Rick Cassidy
資深副總經理暨美國子公司執行長
學歷:
美國西點軍校工程學位
經歷:
台積電美國子公司客戶管理副總經理
 
David Keller
美國子公司總經理
學歷:
美國聖湯瑪斯大學商學碩士
經歷:
台積電美國子公司執行副總經理
 
Maria Marced
歐洲子公司總經理
學歷:
西班牙馬德里理工大學電信工程博士
經歷:
飛利浦半導體/恩智浦半導體資深副總裁暨行銷業務總經理
 
小野寺誠
日本子公司總經理
學歷:
美國Willamette University企業管理碩士
經歷:
台積電日本子公司副總經理
 
杜隆欽
台積電 (中國) 有限公司總經理
學歷:
美國杜蘭大學商學碩士
經歷:
本公司人力資源副總經理
本公司企業規劃組織協理
 
羅鎮球
台積電南京有限公司總經理
學歷:
北京大學工商管理學碩士
經歷:
台積電(中國)有限公司 副總經理
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