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55nm Technology |
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TSMC's 55nm process is a 90% linear shrink process from the 65nm process.
It provides cost savings while maintaining the same speed with similar
or lower power. The 55nm logic family includes general purpose (GP)
and consumer platform (GC) options. The GP process will be the first
to go on-line in Q1 2007, followed by 55GC. And because 55nm is a
direct shrink, designs can be ported easily from 65nm products with
minimum risk and effort.
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技術專區
