If you have a system-on-chip (SoC), system-in-package (SiP), or system-on-board (SoB) project, TSMC’s mainstream technology platform derivative and specialized process technologies can provide a comprehensive feature suite across process nodes. The TSMC COMPATIBLE process technology portfolio includes:

High voltage
CMOS image sensor
Logic non-volatile memory
Embedded flash
Embedded DRAM
MEMS
Silicon germanium

In addition, TSMC is the only foundry to provide half node technologies that drive die cost reductions for late life cycle products.

All mainstream specialty technologies and half nodes feature a high degree of process stability and run on the foundry industry’s largest available capacity, providing consistent support across multiple fabs.