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Feature
Technology |
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In this era of omnipresent design differentiation,
TSMC is proactively taking step to satisfy the semiconductor
industry's needs. No longer is a logic focused process technology
able to meet all market requirements. Rather, today's industry
innovator requires special feature technologies such as mixed-signal/RF,
embedded high density memory, non-volatile memory, high voltage
devices and CMOS image sensor technologies. Feature technologies
span TSMC's Advanced and Mainstream Logic Technology platforms.
All feature technologies are supported down to the 0.18-micron
process node. Embedded high density memory is available in Advanced
Technology platforms down to the0.13-micorn node. Mixed signal
technology is available down to the 90nm process node. Together,
TSMC's feature technologies, integrated with their corresponding
logic technologies provide a total platform solution meeting
the industry's broadest range of IC design requirements.
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| HDM |
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TSMC provides a wide array of technology
and process options when it comes to high density memory
(HDM). Customers can easily identify the best-fit technology
and process node based on their design and desired cost
model. Full logic compatibility allows customers to enjoy
benefit of using existing IP at design stage, shorter
manufacturing cycle time, excellent yields, minimal cost
premium and fast time-to-market.... |
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| NVM |
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| TSMC's embedded non-volatile memory
offering (NVM) sees the foundry segment's most comprehensive
and innovative technologies. Depending on application
complexity, customers can choose from high-density capable
EmbFlashSM to low-density logic NVM and Electrical
Fuse. TSMC's NVM process line has been widely used to
manufacture a broad range of products found in MCU, DSP,
smart card, cellular communications, automotive, CPLD,
and many other applications... |
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| MS
/ RF |
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| Looking for the foundry leader in Mixed
Signal/RF technology production? Look to TSMC. We are
the only foundry shipping over one and half million Mixed-Signal/RF
wafers.... |
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| SiGe |
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| TSMC is the first pure-play foundry
to offer silicon germanium (SiGe) BiCMOS technology, which
is expected to be in high demand for high performance
and low power communications applications... |
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| High
Voltage |
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| TSMC provides the foundry’s
broadest portfolio of high voltage process technologies
and services to meet the growing demand for the hottest
new digital multimedia products. TSMC’s high voltage
processes, coupled with our manufacturing expertise and
value-added services, have brought leading edge products
to market within some of the tightest market windows for
over 10 years.... |
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技術專區
