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TSMC Reference Flow 8.0

Reference Flow 8.0 Paves the Way for 45 Nanometer Technology Design Support

TSMC introduced the industry's first Reference Flow in 2001. The company has since established Reference Flow as a new foundry design service standard, and continues to enhance its Reference Flow capabilities. The result is the most comprehensive portfolio, featuring seven consecutive releases enabling designers to design in TSMC’s advanced technologies.

As the foundry industry design methodology leader, TSMC raises the bar by addressing the most critical design challenges today with Reference Flow 8.0.

Power Management

Low power has been a key theme within the Reference Flow. Reference Flow 8.0, provides leading-edge low power features including:
	Dual power SRAM addressing the Vcc minimum limitation for dynamic power reduction
	Long channel device for leakage reduction
	Data retention of coarse grain power gating

All these features were developed in TSMC 45nm technology. Also covered is the comprehensive 45nm design flow addressing design rule requirements and handling the shrink factor throughout the design cycle.

Design for Manufacturing (DFM)

In Reference Flow 7.0, model-based DFM was introduced as a new way to handle DFM challenges for 65nm technologies and beyond to pinpoint manufacturing fatal hot spots or weak points related to Layout Patterning Check (LPC), Virtual Chemical Mechanical Polishing (VCMP), and Critical Area Analysis (CAA). Reference Flow 8.0, expands the model-based approach to cover automatic DFM hot spot fixing to eliminate manual correction. DFM electrical variability models track the parametric performance shift due to DFM effects.

Statistical Timing Analysis

Reference Flow 8.0 proposes a methodology that handles intra-die variation as well as statistical leakage and statistical timing optimization. This provides additional benefits to designers by reducing the need for over-design and achieves higher robustness to process variation. Since library characterization is one of the major challenges when handling intra-die variation methods for statistical library characterization were also developed.

Need further information about TSMC Reference Flow? Please log in to TSMC-Online^SM, and click on "Reference Flow" under the Design Portal category.

Please contact Andrew Wu (email address: andrew_wu@tsmc.com ) should you have questions, suggestions, and comments.

	Reference Flow 8.0 Press Release
	Reference Flow 7.0 Press Release
	Reference Flow Release 7.0