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Assembly Services
 
TSMC can provide in-house ceramic package assembly quick-turn service within 24 hours for our customers, and this quick-turn work is very helpful to our customers for functional verification in the shortest time. Besides quick-turn service, ceramic packaging has additional advantages, such as:

Flexible for low volume & special requirement
Functional verification without probe card
Easy failure analysis
Cost effectiveness

In addition, TSMC's ceramic assembly line can offer aluminum wire and gold wire bondability tests for:

Verification of and consultation on customer bond pads.
Lifting/non-sticking issues
New Fab process change verification
R&D of new technology release
Assembly Test Service Flow