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Testing Services |
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| Both wafer and package testing services are available from TSMC, for memory, logic and mixed-mode products. These services provide a total testing solution for our customers, from test program development to wafer and package testing. Among the advanced testing procedures implemented at TSMC is automated test data collection for engineering analysis. Additionally, TSMC provides probe card making service as an integral part of our manufacturing operations. Probe card making can eliminate faults and enhance the readiness of meeting customers' requirements. |
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| Wafer Probing and Final Test Services |
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| Testing Capability |
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專業服務
