Dr. N.S. Tsai, TSMC Vice President of Quality and Reliability, joined the company in 1989. As head of Quality and Reliability since 2004, Dr. Tsai has led the successful customer qualification of 90nm, 80nm, and 65nm technologies.

Prior to that, he served in a broad variety of positions in TSMC including R&D, Operations, and Assembly & Testing. He was director of Fab 1 from 1993 to 1995, and served as director of Fab 4 from 1995 to 1997, where he established standard quality systems that made Fab 4 an outstanding manufacturing as well as a R&D development fab for several technology generations. Dr. Tsai also established TSMC's first 12-inch pilot line in 2000, and was responsible for evaluation and selection of production tools, development of automated manufacturing systems, and transition from 8-inch to 12-inch production. He also developed TSMC's flip chip technology and established TSMC's first 12-inch wafer bumping line when he was the head of Assembly and Test.