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The TSMC Open Innovation Platform® hastens the pace of innovation amongst the semiconductor design community, its ecosystem partners and TSMC's IP, design implementation and design for manufacturing (DFM) capabilities, process technology and backend services. A key element of the Open Innovation Platform® is a set of ecosystem alliances and collaborative components initiated and supported by TSMC that more efficiently empower innovation throughout the supply chain and that drive the creation and sharing of newly-created revenue and profits. TSMC's Active Accuracy Assurance (AAA) initiative is critical to the Open Innovation Platform, providing the accuracy and quality required by ecosystem interfaces and collaborative components.

The Open Innovation Platform® is the substantiation of TSMC's Open Innovation model that brings together the thinking of customers and partners under the common goal of reducing design time, minimizing time-to-volume, speeding time-to-market, and ultimately shortening time-to-money.

The Open Innovation Platform® is hosted by TSMC and built on the company's design-enabling building blocks and an ecosystem interface. The Open Innovation Platform® is available to customers and ecosystem partners to improve time-to-market, increase return on investment and reduce waste.

The IC Industry Foundation

TSMC provides the robust design ecosystem, technologies and manufacturing excellence that are the foundation of the IC industry and promote the highest level of collaboration to drive you next innovation with TSMC.




台積公司董事長張忠謀博士榮膺並出席富比世雜誌全球百大最偉大商業思想家(2017/09/21)
   
Xilinx、Arm、Cadence、台積公司共同發表全球首款採用7奈米製程的CCIX試產晶片(2017/09/11)
   
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