首頁 > 專業積體電路製造服務 > 專業技術 > 未來研發計劃
未來研發計劃    
專業技術
未來研發計劃
邏輯製程
特殊製程
卓越製造
晶圓製造服務
開放創新平台
台積大同盟
To maintain and strengthen TSMC’s technology leadership, the Company plans to continue investing heavily in R&D. In addition to 7nm and 5nm CMOS nodes already in the pipeline, the Company’s reinforced exploratory R&D work is on track to establish a solid foundation to feed into technology platforms beyond the 5nm node. The Company’s exploratory work focuses on new transistors and technologies, such as 3D structures, strain-engineered CMOS, high-mobility materials and novel 3D IC devices. These studies emphasize innovation and are guided by deep understanding of the fundamental physics of nanometer CMOS transistors and related technologies. The Company also continues to collaborate with external research bodies from academia and industry consortia alike with the goal of extending Moore’s Law and paving the road to future cost-effective technologies and manufacturing solutions for its customers.

With a highly competent and dedicated R&D team and its unwavering commitment to innovation, TSMC is confident in its ability to deliver the best and most cost-effective SoC technologies to its customers and to drive future business growth and profitability for years to come.

Summary of TSMC’s Major Future R&D Projects

Project Name Description Risk Production (Estimated Target Schedule)
7nm logic platform technology and applications 4th generation FinFET CMOS platform technology for SoC 2017
5nm logic platform technology and applications 5th generation FinFET CMOS platform technology for SoC 2019
3D IC Cost-effective solution with better form factor and performance for SiP 2016 ~ 2017
Next-generation lithography EUV lithography and related patterning technology to extend Moore’s Law 2016 ~ 2019
Long-term research Specialty SoC technology (including new NVM, MEMS, RF, analog) and transistors for 5nm node and beyond 2015 ~ 2019

The projects above accounted for roughly 70% of the total R&D budget in 2017, estimated to be around 8% of 2017 revenue.
台積公司2017年第三季每股盈餘新台幣3.47元(2017/10/19)
   
台積公司資深副總經理左大川博士退休獲准(2017/10/16)
   
Media Contacts
開放創新平台 (Open Innovation Platform®)
技術研討會/ 產業展覽與活動/ 投資人會議
最新消息
業務服務
資料中心
TSMC-Onlinenew window
台積公司客戶入口網站。
TSMC-Supply Online
台積公司供應商網路平台,一個更聰明的交易平台。
Member Login
加入台積公司企業網站會員,即時取得最新企業訊息。
閱讀更多台積公司資訊。
Open Innovation Platform® 首頁     與我們聯繫     網站地圖     問答集     法律與商標     隱私權政策
Copyright© 2010-2017 台灣積體電路製造股份有限公司 著作權所有