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5nm Technology
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0.18-micron Technology
3-micron Technology
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TSMC has always insisted on building a strong, in-house R&D capability. As a global semiconductor technology leader, TSMC provides the most advanced and comprehensive portfolio of dedicated foundry process technologies.
5nm Technology
TSMC's 5nm Fin Field-Effect Transistor (FinFET) process technology is optimized for both mobile and high performance computing applications. It is scheduled to start risk production in the second quarter of 2019...More

7nm Technology
TSMC's 7nm Fin Field-Effect Transistor (FinFET) process technology provides the industry's most competitive logic density and sets the industry pace for 7nm process technology development by delivering 256Mb SRAM with double-digit yields...More

10nm Technology
TSMC's 10nm Fin Field-Effect Transistor (FinFET) process provides the most competitive combination of performance, power, area, and delivery parameters...More

16/12nm Technology
In November 2013, TSMC became the first foundry to begin 16nm FinFET risk production. In addition, TSMC became the first foundry that produced the industry's first 16nm FinFET fully functional networking processor for its customer...More

20nm Technology
TSMC became the world's first semiconductor company that begins 20nm volume production, using its innovative double patterning technology, in 2014...More

28nm Technology
TSMC became the first foundry to provide the world's first 28nm General Purpose process technology in 2011 and has been adding more options ever since...More

40nm Technology
TSMC became the first foundry to mass produce a variety of products for multiple customers using its the 40nm process technology in 2008...More

65nm Technology
TSMC became the first foundry to begin 65nm risk production in 2005 and passed product certification the following year. The Company also introduced foundry's first 65nm Low Power (LP) process to meet customers' needs...More

90nm Technology
TSMC became the first semiconductor company to produce fully-functional 90nm chips using immersion lithography technology. The Company announced the accomplishment at SEMICON Japan in December 2004...More

0.13-micron Technology
TSMC launched the semiconductor industry's first 0.13-micron (µm) low-k, copper system-on-a-chip (SoC) process technology. The Company insisted on building its own R&D capabilities...More

0.18-micron Technology
TSMC offered the world's first 0.18-micron (µm) low power process technology in 1998. The Company continued to build its technology leadership by rolling out new low power process processes every two years...More

3-micron Technology
TSMC has persistently maintained a “building in-house R&D" strategy since its founding in 1987, which has given the company significant competitive advantages...More
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