Three years and over one million shipped wafers after it became the first foundry to offer 0.15-micron process technology, TSMC is rolling out a mixed-signal version of the process. Dubbed CM015LV, the process is logic based to take advantage of well-established process stability, supports a proven high performance transistor and provides a low (1.2V) operating voltage.

TSMC's 0.15-micron process is installed in Fabs 5, 6, 8, 12, SSMC and WaferTech and has proven a workhorse for performance-driven applications in the graphics and communications market segments.

The new 0.15-micron mixed-signal technology includes multiple-Vts for active devices (1.2V core device - high-Vt, standard-Vt and native-Vt; 3.3V I/O device - standard-Vt and native-Vt) and a complete set of passive devices, including MiM capacitor, MOS varactor, junction varactor, poly resistor, OD resistor, high-resistance implant resistor (1,000 ohm/sq.), as well as bipolar PNP/NPN. SPICE models, device matching and characterization reports are also available.

An extensive array of libraries, including core cells, memory compilers and I/O cells from TSMC and third-party providers, support the 0.15-micron technology platform.

Early 0.15-micron mixed signal adopters include designs targeted for DVD, digital TV, gigabit ethernet, NIC, WLAN, and xDSL applications.