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24-7 Reliability Information Now On-line |
TSMC has added to
the robustness of eFoundry capability
with the roll out of "TSMC On-line
Reliability Model", a new web-based system that provides consistent reliability
information and slashes the time required for traditional correspondence.This new capability, which is accessed through TSMC-Online, provides a user-friendly environment to perform a quick product reliability assessment. It provides circuit lifetime and production failure rate predictions in conjunction with customized voltage, temperature and layout configurations of TSMC's process technologies, including intrinsic and product-level reliability. ( see Figure 1 ) |
 Figure 1 |
| Intrinsic reliability
assessment information includes: gate oxide integrity (GOI), hot carrier
injection (HCI), negative bias temperature instability (NBTI), electromigration
(EM) and inter-metal dielectric time depend dielectric breakdown (IMD-TDDB).
Product-level reliability information includes early failure rate (EFR),
long term failure rate (LTFR), estimated voltage overdrive capability, the
impact of voltage overshoot on circuit reliability and allowable junction
temperature. |
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TSMC
On-line Reliability Model |
 Figure 2 |
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The "Overall Reliability Assessment"
- On this site, customers can obtain prediction of circuit lifetime for
a user-defined set of circuit operating conditions with transistor and interconnect
layout geometry (
as shown in Figure 3 ). |
 Figure 3 |
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The "Advanced Reliability Assessment" -
On this site, customers can obtain a "Process Reliability Assessment" for
an individual intrinsic reliability failure item under a given set of product
operating and layout condition or a "Product Reliability Assessment" for
EFR, LTFR or voltage, temperature estimate, resulting from user defined
operating condition and product die size.
Customer
feedback has been great and will continue to be a vital element in TSMC
On-line Reliability Model development. At the 2003 Quality Summit, held
in San Jose last November and during the system's pilot run early this
year, many customers showed their interest by providing comments and commentary.
The capability was unveiled in the first quarter of this year with the
launch of 0.13-micron general purpose and low voltage FSG reliability
information. Soon to follow will be reliability information for 0.13-micron
general purpose and low voltage Low-K, 0.15-micron low voltage, 0.18-micron
low voltage, Nexsys 90-nanometer general purpose Low-K technologies. |
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