Nanometer manufacturing processes, coupled with SoC complexity, have made assembly and test a more critical part of the manufacturing value chain, pushing these technologies into new frontiers.

Today's silicon devices, characterized by higher I/O counts, faster clock speeds, tightly integrated functionality, and more power consumption, require more than sophisticated circuit design and state-of-the-art wafer processing. They also require more sophisticated backend technology that is more tightly tied to the entire design chain.

TSMC recognized this need early on and, in early 2002, centralized all backend organizations and resources, undertaking a program to enrich its backend technical content and services. As a result, TSMC is the first and only dedicated foundry to provide integrated in-house 8-inch and 12-inch wafer bumping services for flip-chip applications.

The company's internal bumping facility is now in volume production and supports a 12,000 wafer per month 8-inch capacity. Twelve-inch capacity will ramp up to 5,000 wafer per month by the third quarter of this year. The 8-inch bump line has been qualified for both 0.13-micron FSG and low-K technologies. Solder bumping is also available on TSMC's CyberShuttle service to expedite new design validation and qualification.

With over 15 years experience, TSMC testing services run the gamut from on-schedule delivery wafer sort to multiple IC testing protocols. TSMC's testing facility is equipped with multiple platforms for most types of CP manufacturing. TSMC's Testing Department supports numerous test engineering activities, including test program development, test program debugging, and IP design-for-test (DFT) activities.

TSMC's test services stretch far beyond a single brick and mortar facility. An internet-based remote test system provides worldwide access to TSMC testers, creating an efficient and economic path for engineering troubleshooting and debugging. State-of-the-art vertical probe card manufacturing and maintenance ensure prompt bumped wafer sort service. A flexible statistic bin control system (Enhanced Statistic Bin Control or ESBC) executes complicated die-based bin control that enhances efficient process control.

Through TSMC's Turnkey Service, assembled and tested parts can be drop-shipped to any location in the world. Turnkey Services provide faster cycle time, trans-parent WIP visibility through TSMC-Online and consistent on-time delivery.

In addition to its in-house capabilities, TSMC has successfully collaborated with leading-edge assembly subcontractors to qualify 0.13-micorn low-k processes in both wire-bond and flip-chip packages.