Logic-Based Non-Volatile Memory Brings New Life to Mature Applications

 
  At TSMC, being the foundry industry technology leader means more than being first to market with the latest advanced technology. It also means providing robust derivative technologies that actually empower more innovative than today's leading-edge 90-nm processes.

 
  Embedded memories in general, and non-volatile memory (NVM) in particular, have historically been one of the company's core competencies and embedded flash is one of TSMC's more popular NVM processes at 0.50-micron, 0.35-micron, 0.25-micron, and, most recently, 0.18-micron.

 
 

 
  Since TSMC debuted its embedded flash process, more than 400 designs have entered volume production using this technology. And while embedded flash has more than proved its merit, the market is seeking a lower density process that ranges from few bits to a few thousand bits. To respond to this need for low density, low cost alternatives, TSMC is working with several partners to define a logic-based NVM process that requires no
extra masks.

 
  Logic-based NVM can be used to replace EPROM in micro controllers, to replace EEPROM in ID/RF-ID devices, or to replace fuses in analog calibration and trimming applications. Markets for these applications and others like them are quickly growing.

 
  TSMC's logic-based one time programmable (OTP) 0.35-micron process is now qualified and ready for production. The 0.25-micron and 0.18-micron multiple times programmable/
one time programmable (MTP/OTP) qualifications are currently underway and will be completed this quarter and early next year respectively.

 
 


 

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