TSMC Annual Report > 2016 > Capital and Shares > Issuance of Corporate Bonds

Issuance of Corporate Bonds

Corporate Bonds

NTD Corporate Bonds

As of 02/28/2017

NTD Corporate Bonds (image)

USD Corporate Bonds

As of 02/28/2017

Issuance

Senior Unsecured Notes (Note)

Issuing Date

04/03/2013

Denomination

US$200,000 and integral multiples of US$1,000 in excess thereof

Listing

Singapore Exchange

Offering Price

2016 Notes: 99.988%
2018 Notes: 99.933%

Total Amount

US$1,500,000,000

Coupon

2016 Notes: 0.950% p.a.
2018 Notes: 1.625% p.a.

Tenor and Maturity Date

2016 Notes: 3 years
Maturity: 04/03/2016
2018 Notes: 5 years
Maturity: 04/03/2018

Guarantor

TSMC

Trustee

Citicorp International Limited 

Underwriter

Goldman Sachs International

Legal Advisor

Jones Day
Maples and Calder

Auditor

Deloitte & Touche

Repayment

Bullet

Outstanding

US$1,150,000,000

Redemption or Early Repayment Clause

At issuer’s option

Covenants

Limitations on (1) liens and (2) sale and leaseback transactions

Credit Rating

A1 (Moody’s Investors Service, 03/15/2013)
A+ (Standard & Poor’s Rating Services, 03/15/2013)

Other Rights of
Bondholders

Conversion Right

 None

Amount of Converted
or Exchanged Common
Shares, ADRs or Other
Securities

Not Applicable

Dilution Effect and Other Adverse Effects on Existing Shareholders

None

Custodian

None

Note:

Issued by TSMC Global Ltd., a wholly-owned subsidiary of TSMC, and unconditionally and irrevocably guaranteed by TSMC.

Convertible Bond: None.

Exchangeable Bond: None.

Shelf Registration: None.

Bond with Warrants: None.