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Corporate Executives
Dr. Mark Liu
Chairman
Education:
Ph.D., Electrical Engineering and Computer Science, University of California, Berkeley, USA
Experience:
President and Co-CEO, TSMC
Senior Vice President, Operations, TSMC
Senior Vice President, Advanced Technology Business, TSMC
Vice President, South-Site Operation, TSMC
President, Worldwide Semiconductor Manufacturing Corp.
Dr. Mark Liu is currently Chairman at TSMC. Prior to assuming this post, he was President and Co-CEO from November 2013 to June 2018 and Co-Chief Operating Officer from March 2012 to November 2013. Before that, he was Senior Vice President of Operations from 2009 to 2012. From 2006 to 2009, he was a Senior Vice President responsible for the Advanced Technology Business at TSMC. He served in a number of executive positions at TSMC Fabs and the Operations organization from 2000 to 2006, and from 1999 to 2000, he was President of Worldwide Semiconductor Manufacturing Corp.

Prior to joining TSMC, from 1987 to 1993, he was with AT&T Bell Laboratory, Holmdel, NJ, as a research manager for the High Speed Electronics Research Laboratory, working on optical fiber communication systems. From 1983 to 1987, he was a process integration manager of CMOS technology development at Intel Corporation, Santa Clara, CA, developing silicon process technologies for Intel microprocessors.

Mark Liu received B.S. degree in electrical engineering from National Taiwan University. He received M.S. and Ph.D. degrees in electrical engineering and computer science from University of California, Berkeley.
Dr. C.C. Wei
Chief Executive Officer and Vice Chairman
Education:
Ph.D., Electrical Engineering, Yale University, USA
Experience:
President and Co-CEO, TSMC
Senior Vice President, Business Development, TSMC
Senior Vice President, Mainstream Technology Business, TSMC
Vice President, South-Site Operation, TSMC
Senior Vice President, Technology, Chartered Semiconductor Manufacturing Ltd.
Dr. C. C. Wei joined TSMC in 1998 and currently serves as Chief Executive Officer and Vice Chairman. Prior to his recent appointment, Dr. Wei was TSMC's President and Co-CEO from November 2013 to June 2018 and Co-Chief Operating Officer from March 2012 to November 2013. From 2009 to 2012, he was TSMC’s Senior Vice President of Business Development. Before that, he was Senior Vice President of Main Stream Technology Business.

Before joining TSMC, he was Senior Vice President of Technology at Chartered Semiconductor and Senior Manager, Logic and SRAM technology development at ST Microelectronics.

C. C. Wei received B.S. degree in electrical engineering from National Chiao Tung University. And later he was awarded his PhD by Yale University.
Ms. Lora Ho
Senior Vice President, Finance and Chief Financial Officer / Spokesperson
Education:
EMBA, National Taiwan University, Taiwan
Experience:
Vice President, Chief Financial Officer and Spokesperson, TSMC
Vice President, TI-Acer Semiconductor Manufacturing Corp.
Lora Ho is the Chief Financial Officer and Spokesperson of Taiwan Semiconductor Manufacturing Company Limited (TSMC).

Joined TSMC in 1999, Ms. Ho served as Corporate Controller from 1999 to 2003, and became the Chief Financial Officer since 2003. Prior to TSMC, Ms. Ho served various positions in Accounting and Finance field in Foreign invested companies.

Ms. Ho was awarded " Outstanding Financial Executive " for the year of 1993 by Financial Executives Institute, The " Best Companies' Best CFO " of Taiwan from 2007-2010 by FinanceAsia , also the Best CFO in Asia in 2011 by Institutional Investor.

Ms. Ho received her MBA degree from National Taiwan University in 2003 and a B.A. degree from National Cheng-chi University in 1978.
Dr. Wei-Jen Lo
Senior Vice President, Research & Development / Technology Development
Education:
Ph.D., Solid State Physics and Surface Chemistry, University of California, Berkeley, USA
Experience:
Vice President, Operations for Manufacturing Technology, TSMC
Vice President, Advanced Technology Business, TSMC
Vice President, Research & Development, TSMC
Vice President, Operation II, TSMC
Director, Advanced Technology Development & CTM Plant Manager, Intel
Dr. Lo is TSMC's Senior Vice President of Research and Development. Prior to this post, he served as Vice President of the Company's Advanced Technology Business.

Dr. Lo joined TSMC in 2004 as Vice President of Operations II and served as Vice President of Research & Development from 2006 to 2009.

Prior to joining TSMC, Dr. Lo was Director of Technology Development and Plant Manager with Intel Corporation's Technology and Manufacturing Group. From 1997 to 2000, he served a Factory Manager, responsible for running Intel's development factory in Santa Clara, California.

Dr. Lo has also worked at U.S. university, the Motorola Research and Development Lab and the Xerox Microelectronics Center.

Dr. Lo received his B.S. degree in physics from National Taiwan University and his M.S. and Ph.D. degrees in Solid State Physics and Surface Chemistry from University of California, Berkeley.
Mr. Rick Cassidy
Senior Vice President / Chief Executive Officer of TSMC North America
Education:
B.S. degree in Engineering, United States Military Academy at West Point, USA
Experience:
Vice President of TSMC North America Account Management
Mr. Cassidy’s electronics career began at Fairchild Semiconductor, later acquired by National Semiconductor. Over an 18-year span he rose through manufacturing, engineering, quality and reliability, and marketing, culminating with his appointment as Vice President and General Manager of National’s Military & Aerospace Division and Co-Chair of National’s General Manager Council.

He joined TSMC North America in 1997 as Vice President of Account Management; promoted to President, TSMC North America in 2005; elected Corporate Vice President, TSMC, Ltd. in 2008; and elected Senior Vice President, TSMC, Ltd. in 2014. Over nearly two decades at TSMC he has helped lead the company to record growth, while contributing greatly to the success of the fabless semiconductor business model. He currently serves on the Global Semiconductor Alliance (GSA) Board of Directors, an organization dedicated to the advancement of the worldwide semiconductor industry.

Prior to entering the semiconductor industry, Mr. Cassidy served as an officer in the U.S. Army. He holds a Bachelor of Science degree in Engineering from the United States Military Academy at West Point.
Mr. Y.P. Chin
Senior Vice President, Operations / Product Development
Education:
M.S., Electrical Engineering, National Cheng-Kung University, Taiwan
Experience:
Vice President, Product Development in Operations, TSMC
Mr. Y.P. Chin was promoted to Sr. Vice President in November 2016. Prior to this post, Mr. Chin served as TSMC's Vice President of Operations for Product Development. Prior to this, he was Vice President of Advanced Technology Business in TSMC, sharing responsibility with Senior Vice President Dr. Mark Liu for TSMC's advanced technology and 300mm fab operations.

Mr. Chin joined TSMC when it was founded in 1987 and has made significant contribution to TSMC's product engineering capability throughout his career. He was Director of Fab 1 from 1997 to 1998, and in later positions helped manage yield improvement in all new generations of advanced technology, including 0.13-micron, 90nm, 65nm, and 45nm nodes. Mr. Chin pioneered the development of TSMC's Golden Spice Modeling methodology and Design For Manufacturing program.

Prior to joining TSMC, Mr. Chin worked as an engineer with the Industrial Technology Research Institute's Electronics Research and Service Organization (ERSO-ITRI).

Mr. Chin earned his B.S. and M.S. degrees in Electrical Engineering from National Cheng Kung University.
Dr. Y.J. Mii
Senior Vice President, Research & Development / Technology Development
Education:
PhD, Electrical Engineering, University of California, Los Angeles, USA
Experience:
Vice President, Technology Development in R&D, TSMC
Dr. Y.J. Mii was promoted to Sr. Vice President in November 2016. Prior to this post, Dr. Y.J. Mii served as TSMC's Vice President of Research and Development (R&D) since 2011. He joined TSMC in 1994 and has been involved continuously in the development and manufacturing of advanced CMOS technologies in both Fab Operation and R&D. Dr. Mii joined R&D in 2001, managing both 90nm and 40nm technology development. Following that he began supervising 28nm technology development, accelerating it to lead the foundry industry.

Dr. Mii was a research staff member at IBM Research before joining TSMC. He joined TSMC as a deputy manager of Fab 3 engineering, eventually rising to senior director of R&D before being promoted.

He holds a B.S. in electrical engineering from National Taiwan University, as well as an M.S. and Ph.D. in Electrical Engineering from the University of California, Los Angeles (UCLA).
Mr. M.C. Tzeng
Vice President, Operations / Affiliate Fabs
Education:
M.S., Applied Chemistry, Chung Yuan University, Taiwan
Experience:
Vice President, Mainstream Technology Business, TSMC
Vice President, Operations I, TSMC
Senior Director, Fab 2, TSMC
Mr. M.C. Tzeng is TSMC's Vice President of Operations for Affiliate Fabs. Prior to this post, he served as Vice President of TSMC's Mainstream Technology Business. He joined the Company in 1987.

Prior to TSMC, Mr. Tzeng worked for ERSO/ITRI on IC process technology projects. Mr. Tzeng has compiled an extensive IC manufacturing background having held positions as a Process Engineer, Fab Section Manager, Fab Department Manager and Fab Senior Director. His in-depth knowledge covers both on process technology development and Fab operations.

Mr. Tzeng received his B.S. degree in Chemistry from Tamkang University and his M.S. degree in Applied Chemistry from Chung Yuan University.
Dr. N.S. Tsai
Vice President, Quality & Reliability
Education:
Ph.D., Materials Science, Massachusetts Institute of Technology, USA
Experience:
Senior Director, Quality & Reliability, TSMC
Dr. N.S. Tsai, TSMC Vice President of Quality and Reliability, joined the company in 1989. As head of Quality and Reliability since 2004, Dr. Tsai has led the successful customer qualification of 90nm, 80nm, and 65nm technologies.

Over his career at TSMC, Dr. Tsai has a wide variety of positions in R&D, Operations, and Assembly & Testing. He was director of Fab 1 from 1993 to 1995, and served as director of Fab 4 from 1995 to 1997, where he established standard quality systems that made Fab 4 an outstanding manufacturing facility as well as TSMC's R&D development fab for several technology generations.

Dr. Tsai also established TSMC's first 12-inch pilot line and was responsible for evaluating and selecting production tools, developing automated manufacturing systems, and transitioning from eight-inch to 12-inch production. He also developed TSMC's flip chip technology and established TSMC's first 12-inch wafer bumping line when he was the head of Assembly & Test.

Before joining TSMC, Dr. Tsai served with AT&T's R&D department for 5 years.

Dr. Tsai earned his B.S. in Physics from National Tsinghua University, his M.S. degree in Physics from Temple University and his Ph.D. in Materials Science from Massachusetts Institute of Technology.
Mr. J.K. Lin
Vice President, Information Technology and Materials Management & Risk Management
Education:
B.S. degree in Industrial Education & Technology, National Changhua University of Education
Experience:
Vice President of Mainstream Fabs, TSMC
Senior Director of 300mm Fabs
Director of Fab 12, Fab 6 and Fab 3, TSMC
J.K. Lin currently serves as Vice President of Information Technology and Materials Management & Risk Management at TSMC. Prior to this post, J.K. served as Vice President of Mainstream Fabs and Materials Management & Risk Management.

J.K. Lin joined TSMC when it was founded in 1987 and held a number of manufacturing positions including Equipment Engineer, Section Manager, and Department Manager in Fab1 and 2. He was responsible for the construction of Fab 3 was later Fab Director of Fab 3, Fab 7, Fab 6, Fab 12, and Senior Director for 300mm Fabs. He worked in the Electronic Research and Service Organization (ERSO) of Taiwan's Industrial Technology Research Institute (ITRI) before joining TSMC.

J.K. Lin earned his B.S. degree from National Changhua University of Education.
Mr. J.K. Wang
Vice President, Operations / Fab Operations
Education:
M.S., Chemical Engineering, National Cheng-Kung University, Taiwan
Experience:
Senior Director, Operations / 300mm Fabs, TSMC
Senior Director, 6" & 8" Fabs, Mainstream Technology Business, TSMC
J. K. Wang is currently Vice President of Operations for 300mm fabs. Prior to this post, he was the senior director of 300mm fab operations.

J. K. Wang has served at TSMC since the company was founded in 1987. During his career with TSMC, he has been involved in many different aspects of the company's operations, including module engineering, process integration, R&D technology development, manufacturing, and fab management. Previously, he had been the fab director of Fab4, Fab3, Fab14 and senior director of 6" and 8" fab operations.

J. K. Wang has been deeply involved in building up TSMC's manufacturing technology and systems, particularly fab automation and manufacturing infrastructure. He currently also supervises TSMC 450mm program to prepare next generation fab.

J. K. Wang received his B.S. and M.S. degrees in chemical engineering from National Cheng-Kung University in 1981 and 1983 respectively.
Dr. Irene Sun
Vice President, Corporate Planning Organization
Education:
Ph.D., Materials Science and Engineering, Cornell University, USA
Experience:
Senior Director, Corporate Planning Organization, TSMC
General Manager, Technology Group, IBM Taiwan
Dr. Irene Sun is currently TSMC's Vice President Corporate Planning. Prior to this post, she was Senior Director of the Corporate Planning Organization. She joined TSMC in October 2003 as Director of the Corporate Pricing Division.

Prior to TSMC, Dr. Sun worked at IBM for 23 years and held a variety of management positions in R&D, Manufacturing Engineering, Marketing & Sales, and Business Management.

Dr. Sun received her B.S. degree in Nuclear Engineering from National Tsinghua University in Taiwan, and her Ph.D. in Materials Science and Engineering from Cornell University.
Dr. Cliff Hou
Vice President, Research & Development / Technology Development
Education:
Ph.D., Electrical and Computer Engineering, Syracuse University, USA
Experience:
Senior Director, Design and Technology Platform, TSMC
Section Manager, ITRI/CCL Taiwan
Dr. Cliff Hou was appointed TSMC's Vice President of Research and Development (R&D) in August, 2018. Prior to this post, Dr. Hou served as TSMC’s Vice President at Design and Technology Platform from August, 2011 to July, 2018. He joined TSMC in 1997 and has made profound contribution to TSMC's design technology and ecosystem development.

Over the last decade at TSMC, Dr. Hou helped the company establish TSMC’s Open Innovation Platform® (OIP), which has become one of the most powerful design ecosystems in the global semiconductor industry. From 1997 to 2007, Dr. Hou established the company's technology design kit and reference flow development organizations.

Prior to joining TSMC, Dr. Hou was a section manager specializing in physical verification methodologies at the Computer & Communications Research Laboratories, Industrial Technology Research Institute (ITRI/CCL) in Taiwan; and served as an Associate Professor at Kaohsiung Polytechnic Institute, Taiwan.

Dr. Hou received National Manager Excellence Award in 2010. He led the company's Open Innovation Platform project team to win First National Industry Innovation Award in 2011 by the Ministry of Economic Affairs (MOEA), Taiwan.

Dr. Hou holds 46 U.S. Patents and serves as a member of Board of Directors in Global Unichip Corp. He received his B.S. degree in Control Engineering from Taiwan's National Chiao-Tung University, and his Ph.D. in Electrical and Computer Engineering from Syracuse University.
Dr. BJ Woo
Vice President, Office of Strategic Customer Program
Education:
PhD, Chemistry, University of Southern California, USA
Experience:
Vice President, Business Development, TSMC
VP of R&D, Grace Semiconductor Manufacturing Corp.
Director of Technology Integration, Intel Corp.
Dr. BJ Woo currently serves as Vice President of Office of Strategic Customer Program at TSMC. Prior to this role, she had served as Vice President of Business Development from November 2013 to August 2018. Dr. Woo joined TSMC as Senior Director of the Advanced Technology Marketing Division in April 2009, where she was responsible for the advanced technology roadmap and technology definition that targeted high performance and low power applications.

Prior to joining TSMC, BJ spent most of her career at Intel Corporation where she held various senior manager positions in the technology development group. She owns 13 patents and was nominated by Intel to enter the Hall of Fame for WITI (women-in-technology-international) in 2006.

BJ received her B.S. degree from National Taiwan University and her PhD from University of Southern California.
Ms. Sylvia Fang
Vice President, Legal and General Counsel
Education:
Master of Comparative Law, School of Law, University of Iowa
Experience:
Associate General Counsel, TSMC
Director, Corporate Legal Division, TSMC
Senior Associate, Taiwan International Patent and Law Office (TIPLO)
Sylvia Fang was appointed Vice President and General Counsel for TSMC in August, 2014. Previously, she served as Associate General Counsel, heading that organization since February, 2014. Sylvia joined TSMC in 1995. She was previously Director at Corporate Legal Division where she worked on numerous high-profile corporate transactions, precedent-setting intellectual property trade secret litigations, the promotion of significant legal changes and the resolution of corporate governance issues. She also has been working extensively with the Board of Directors, including the independent directors on various Board, Audit Committee and Compensation Committee matters and other special projects.

Prior to her career at TSMC, Sylvia worked at a leading boutique intellectual property law firm (TIPLO) where she developed her expertise on general corporate and IP issues.

The global legal community recognized Sylvia’s achievement in 2005 when the leading publication Asialaw magazine awarded her the “2005 Deep & Far Award for Taiwan In-House Counsel”. She is also known among key government trade, commerce and securities law administrative agencies due to her relations cultivated over the years of promoting important legal changes to support corporate goals.

Sylvia is an attorney admitted in Taiwan having received her LL.B. degree from National Taiwan University, and her M.C.L. from School of Law, University of Iowa.
Ms. Connie Ma
Vice President, Human Resources
Education:
EMBA, International Business Management, National Taiwan University
Experience:
Director of Human Resources, TSMC
Senior Vice President of Global Human Resources, Trend Micro Inc.
Connie Ma has been appointed as Vice President of Human Resources since August 2014.  She joined TSMC in June 2014 as Director of Human Resources.

Connie has over 30 years of HR experience.  Prior to joining TSMC, she held several senior HR managerial positions at Trend Micro Inc., NCR Corporation and AT&T Corporation.  Connie was Senior Vice President of Global Human Resources at Trend Micro where she led corporate transformation by building a global HR team to enhance the execution of corporate strategy and culture in terms of realigning organization structure, strengthening global collaboration and facilitating employee engagement.

Connie holds an EMBA from National Taiwan University and a bachelor's degree in business administration from Soochow University.
Dr. Y.L. Wang
Vice President, Operations / Fab Operations
Education:
PhD, Electrical Engineering, National Chiao Tung University
Experience:
Senior Director, Fab 14B, TSMC
Dr. YL Wang was appointed TSMC's Vice President of Technology Development (TD) in October 2015. Prior to this post, Dr. Wang served as Senior Director of Fab 14B.

Dr. Wang joined TSMC in 1992 and has been deeply involved in building TSMC’s manufacturing technology and methodology. During his 20+ years career, he successfully contributed to mass-production of the company's 0.35-micorn, 0.25-micorn, 0.18-micorn, 0.13-micorn, 90nm, 65nm, 40nm, 20nm and 16nm process technologies, providing significant productivity improvement and defect density enhancement.

Dr. Wang received his B.S. degree in Physics from National Tsing Hua University; his M.S. degree in Materials Science from National Sun Yat-Sen University and Ph.D. in Electrical Engineering and Computer Science from the National Chiao Tung University. He has 109 US patents, and over 100 Republic of China, Peoples Republic of China ,and French patents.
Dr. Doug Yu
Vice President, Research & Development / Integrated Interconnect & Packaging
Education:
PhD, Materials Engineering, Georgia Institute of Technology, USA
Experience:
Senior Director of Integrated Interconnect & Packaging Division in R&D, TSMC
Dr. Doug Yu was appointed TSMC's Vice President in November 2016. Dr. Yu joined TSMC in 1994. He was previously Senior Director of the Integrated Interconnect & Packaging Division, where he led the development of interconnect technology for integrated circuits.

Dr. Yu received his B.S. degree in Physics and M.S. degree in Materials Science and Engineering both from National Tsing Hua University, and his Ph.D. in Materials Engineering from Georgia Institute of Technology. In 2013, he was elevated to IEEE fellow grade.
Dr. Alexander Kalnitsky
TSMC Fellow and Vice President, Operations / More-than-Moore Technologies
Education:
PhD, Electrical Engineering, Carleton University, Canada
Experience:
Senior Director of More-than-Moore Technologies Division in R&D, TSMC
Dr. Alexander Kalnitsky was appointed TSMC's Vice President in November 2016. Prior to this appointment, Dr. Kalnitsky served as a Senior Director of the More-than-Moore Technologies Division.

Dr. Kalnitsky joined TSMC in 2009. At TSMC, he is a well-respected technical leader with an excellent track record in HV/Power/Analog/RF/CIS/MEMS processes development. He was elected a TSMC Fellow in 2013.

Prior to joining TSMC, Dr. Kalnitsky worked for over 30 years in the semiconductor industry at companies such as Intersil, Maxim Integrated Product, National Semiconductor, STMicroelectronics and Northern Telecom

Dr. Kalnitsky received his M.S. degree in Applied Sciences from the University of Toronto, Canada and Ph.D. in Electrical Engineering from Carleton University, Canada. He authored or co-authored over 140 issued U.S. patents (over 20 invention disclosures filed while at TSMC). Alex has over 120 publications in technical journals and conference presentations.
Dr. Kevin Zhang
Vice President, Business Development
Education:
PhD, Electrical Engineering, Duke University, USA
Experience:
Vice President, Research & Development / Design and Technology Platform, TSMC
Vice President, Technology and Manufacturing Group, Intel
Dr. Kevin Zhang currently serves as Vice President of Business Development. Prior to this role, Dr. Zhang served as Vice President of Design and Technology Platform. Before joining TSMC in November 2016, Dr. Zhang was Vice President of Technology and Manufacturing Group and Director of Circuit Technology at Intel, where he was responsible to the development of process design rules, circuit & device modeling, digital libraries, key analog and mixed-signal circuits. He led the development of embedded memory technologies from 90nm to 10nm at Intel. He was also responsible to the design and validation of lead vehicles for process technology development at Intel. Dr. Zhang was elected as Intel Fellow in 2005 and led his teams to win 5 Intel Achievement Awards, the highest technical accomplishments at the company.

Dr. Zhang has published more than 80 papers at international conferences and in technical journals and is the editor of Embedded Memory for Nano-Scale VLSIs, published by Springer in 2009. He holds 55 U.S. patents in the field of integrated circuit technology. Dr. Zhang was the 2016 International Solid-State Circuit Conference (ISSCC) Program chair and serves on IEEE VLSI Executive Committee. He is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE). He received his bachelor's degree from Tsinghua University in Beijing and his Ph.D. from Duke University, both in electrical engineering.
Dr. T.S. Chang
TSMC Fellow and Vice President, Operations / Product Development / Fab 12B
Education:
PhD, Electrical Engineering, National Tsing Hua University
Experience:
Senior Director, Fab 12B, TSMC
Dr. T.S. Chang was appointed TSMC’s Vice President in February 2018. Dr. Chang joined TSMC in 1995 and was previously Operations Organization’s Senior Director of Fab12B. Since joining TSMC, Dr. Chang has participated in the development of Fab 1, Fab 4, Fab 8, Fab 12 and Fab 14, having more than 24 years of practical experience in Operations Organization. Dr. Chang is a key person to implement TSMC’s leading edge technology into manufacturing.

Dr. Chang received his B.S. degree in Electrical Engineering; M.S. degree in Electrical Engineering and Ph.D. in Electrical Engineering all from National Tsing Hua University.
Dr. Michael Wu
Vice President, Research & Development / Technology Development / N3 Platform Development Division
Education:
PhD, Electrical Engineering, University of Wisconsin-Madison, USA
Experience:
Senior Director of N3 Platform Development Division in R&D, TSMC
Dr. Michael Wu was appointed TSMC’s Vice President in February 2018. Dr. Wu joined TSMC R&D in 1996 and participated in advanced CMOS technology development from 0.13um, 90nm, 65nm, 28nm, 16nm to 7nm node in the past 20+ years. He was previously R&D Organization’s Senior Director of N3 Platform Development Division. Dr. Wu is a key person to the success of 16FF and 7nm technologies. He is responsible for 3nm technology development as well.

Dr. Wu received his B.S. degree in Electrical Engineering from National Cheng Kung University; his M.S. degree in Electrical Engineering and Ph.D. in Electrical Engineering both from University of Wisconsin-Madison. Michael also received an EMBA degree in the Institute of Technology Management from National Tsing Hua University. He is an IEEE Fellow for his leadership in CMOS process integration. He has published 45 papers and holds 55 patents in the field of semiconductor technology.
Dr. Min Cao
Vice President, Research & Development / Technology Development / Pathfinding
Education:
PhD, Physics, Stanford University, USA
Experience:
Senior Director of Pathfinding Division in R&D, TSMC
Dr. Min Cao was appointed TSMC’s Vice President in February 2018. Dr. Cao joined TSMC in 2002. He has participated in successful development of multiple generations of advanced CMOS technology including N90, N65, N40, N28, N20 and N10. From 2006-2008, he led the development of N40G, the first TSMC technology node utilizing super density scaling (significantly higher than 2x). In 2009, he led the development of N28HP, the 1st TSMC node utilizing HKMG technology. He led the development of N20 from 2010 to 2013, and N10 from 2014 to 2016. Since 2016, Dr. Cao has served as a Senior Director of Path-finding Division.

Prior to joining TSMC, he worked at Hewlett-Packard Laboratories from 1994-1999, PDF Solutions from 1999-2000, and Pericom Semiconductor from 2000-2002, all in the US.

Dr. Cao holds 36 U.S. patents in the field of integrated circuit technology. He has served on many conference committees including IEDM and VLSI Symposium. Min Cao received his B.S. degree in Electronic Engineering from Fudan University in Shanghai, M.S. degree in Physics from San Francisco State University, and his Ph.D. degree in Physics from Stanford University.
Dr. H.-S. Philip Wong
Vice President, Research & Development / Corporate Research
Education:
PhD, Electrical Engineering, Lehigh University, USA
Experience:
Willard R. and Inez Kerr Bell Professor in the School of Engineering, Stanford University
Professor of Electrical Engineering, Stanford University
Senior Manager of IBM Research
Dr. H.-S. Philip Wong currently serves as Vice President of Corporate Research responsible for exploring new technologies for TSMC. Prior to joining TSMC, Dr. Wong is Professor of Electrical Engineering and holds the Willard R. and Inez Kerr Bell Professorship in the School of Engineering at Stanford University. He has 16 years of research and path-finding experience at IBM Research, where many of his early research works have led to product technologies. His research aims at translating discoveries in science into practical technologies and has contributed to advancements in nanoscale science and technology, semiconductor technology, solid-state devices, and electronic imaging. He is the founding Faculty Co-Director of the Stanford SystemX Alliance and Faculty Director of the Stanford Non-Volatile Memory Technology Research Initiative (NMTRI). He has held leadership positions at major multi-university research centers of the National Science Foundation and the Semiconductor Research Corporation.

Dr. Wong received his B.Sc. (Hons.) from the University of Hong Kong, his M.S. degree from Stony Brook University, and his Ph.D. from Lehigh University, all in electrical engineering. He has published over 600 papers at international conferences and technical journals and is the co-author of a book and 11 book chapters. He holds 52 US patents. He is an IEEE Fellow. He received the honorary doctorate degree from Institut Polytechnique de Grenoble, France. Dr. Wong and his students have won best paper awards at premier conferences such as the International Solid-State Circuits Conference (ISSCC) and Symposia on VLSI. He served as General Chair of the International Electron Devices Meeting (IEDM) and is currently the Chair of the IEEE Executive Committee of the Symposia on VLSI Technology and Circuits.

Regional Executives
 
Mr. Rick Cassidy
Senior Vice President / Chief Executive Officer of TSMC North America
Education:
B.S. degree in Engineering, United States Military Academy at West Point, USA
Experience:
Vice President of TSMC North America Account Management
 
Mr. David Keller
President of TSMC North America
Education:
MBA, University of St. Thomas
Experience:
Executive Vice President of TSMC North America
 
Dr. Maria Marced
President of TSMC Europe
Education:
Ph.D., Telecommunications Engineering, Universidad Politecnica de Madrid, Spain
Experience:
Senior Vice President and General Manager, Sales and Marketing, NXP Semiconductors/Philips Semiconductors
 
Mr. Makoto Onodera
President of TSMC Japan
Education:
MBA, Willamette University, USA
Experience:
Vice President, TSMC Japan
 
Mr. L.C. Tu
President of TSMC China
Education:
EMBA, Tulane University, USA
Experience:
Vice President, Human Resources, TSMC
Senior Director, Corporate Planning Organization, TSMC
 
Mr. Roger Luo
President of TSMC Nanjing
Education:
MBA, Peking University, China
Experience:
Vice President of TSMC China
TSMC September 2018 Revenue Report(2018/10/09)
   
TSMC Announces 5th Open Innovation Platform® Alliance, the OIP Cloud Alliance(2018/10/03)
   
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