TSMC provides the foundry
industry's leading advanced process technologies and design
collaterals. These processes include 40nm, 55nm, 65nm, 90nm
and 0.13-micron. TSMC's advanced process technology provides
the optimal combination of gate density, speed, and power,
making it ideal for a broad range of applications such as
computing, communications, and consumer electronics. On top
of each node supports logic designs, mixed-signal/RF while
embedded DRAM option is available for 40nm, 65nm and 90nm.
Design collaterals include TSMC internal macros and the world's
largest third-party IP library portfolios.
Much of the work of TSMC's Open Innovation Platformtm
is target to advanced technology deployment. It is the collaborative
nature of the Open Innovationtm model that brings
together the best technical thinking of partners and customers
alike that have driven TSMC's reputation of ramping advanced
technology processes at the leading edge of the adoption curve.
TSMC advanced technology is significantly ahead
of the ITRS roadmap. The company delivers a new advanced technology
generation every two years. Each node surpasses the previous
one by close to half the area and usually features 30 to 50
percent more performance, while supporting similar leakage
levels. TSMC provides substantial advanced technology capacity
by ramping the same node at multiple 300mm GigaFabs that,
when they reach full capacity, will produce over 100,000 12-inch
wafers per month.
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Technology
