TSMC provides the foundry
industry's leading advanced process technologies and design
collaterals. These processes include 45nm, 55nm, 65nm, 90nm
and 0.13-micron. TSMC's advanced process technology provides
the optimal combination of gate density, speed, and power,
making it ideal for a broad range of applications such as
computing, communications, and consumer electronics. On top
of each node supports logic designs, mixed-signal/RF while
embedded DRAM option is available for 45nm, 65nm and 90nm.
Design collaterals include TSMC internal macros and the world's
largest third-party IP library portfolios.
TSMC advanced technology is significantly ahead
of the ITRS roadmap. The company delivers a new advanced technology
generation every two years. Each node surpasses the previous
one by close to half the area and usually features 30 to 50
percent more performance, while supporting similar leakage
levels. TSMC provides substantial advanced technology capacity
by ramping the same node at multiple 300mm GigaFabs that,
when they reach full capacity, will produce over 100,000 12-inch
wafers per month.
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Technology
