Technology
Home > Technology > Platform Technology Portfolio > Mainstream Logic Technology
 
TSMC-Online
Contact Us
Search

0.15 / 0.18

At more mature process nodes, where claims of technological equanimity abound, TSMC's mission is abundantly clear: Provide a proven path to predictable design and business success.

In pursuit of that mission, TSMC's 0.18-micron and 0.15-micron platforms support the industry's richest technology mix, unmatched manufacturing excellence, and a robust portfolio of time-to-volume focused foundry services that, taken together, are beyond imitation.

TSMC's 0.18-micron and 0.15-micron platforms support embedded memories, mixed-signal/RF, high-voltage, CMOS image sensor processes. These technologies feature a high degree of process stability and run on the foundry industry's largest available capacity that provides consistent support across multiple fabs. Time-to-volume focused foundry services --- front-end design, mask & prototyping Services; backend packaging and test services; front-to-back on-line logistics -- are all dedicated to provide industry-leading yields, quality and manufacturing cycle times.

When it is all said and done only TSMC supports the financial stability for timely capacity expansion, the flexibility to accommodate the dynamic demands of your market environment and the sheer number of successes that combine to provide the single most important value of all ¡K confidence that you'll make your market window.

Applications
TSMC's 0.18-micron and 0.15-micron process technologies provide the optimal combination of density, speed and power to serve a broad range of computing, communications and consumer electronics applications. Device applications in TSMC's 0.18-micron and 0.15-micron process technologies include high- performance 3D graphics and chipsets, digital TV and set-top boxes, high capacity programmable logic devices, and a variety of advanced wire-line and wireless products.