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TSMC's 12-inch fabs are a key part of its manufacturing strategy. The Company currently operates three 12-inch GIGAFAB® facilities – Fab 12, Fab 14, and Fab 15. The combined capacity of the three facilities exceeded six million 12-inch wafers in 2015. Production within these three facilities supports 0.13μm, 90nm, 65nm, 40nm, 28nm, 20nm, and 16nm process technologies, including each technology’s sub-nodes. An additional portion of the capacity is reserved for R&D work on leading-edge manufacturing technologies, which currently supports the technology development of the 10nm node and beyond.

TSMC has developed a centralized fab manufacturing management system (Super Manufacturing Platform, SMP) to provide customers with greater benefits in the form of more consistent quality and reliability, improved flexibility to cope with demand fluctuations, faster yield learning and time-to-volume, and lower-cost product requalification.

  Mini Mega Giga
Profile Monthly 300mm capacity (pcs) ~10K ~25K >100K
Customer Values Operating cost High Medium Low
Flexibility Limited Medium High
Ramp-up agility Limited Medium High
Cycle time Long Medium Short
Delivery precision Limited Medium High
TSMC May 2018 Revenue Report(2018/06/08)
TSMC Sets June 25 as Ex-Dividend Date(2018/06/06)
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