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TSMC Backend Services    
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TSMC Backend Services Overview

In addition to wafer manufacturing services, TSMC provides a wide range of backend services. Take advantage of TSMC's diversified and streamlined one-stop services that include:
Wafer Bumping Services
TSMC offers various leading edge wafer bumping processes...More
Wafer Level Chip Scale Package Services
TSMC's WLCSP portfolio meets the growing demand for fully integrated assembly and test solutions...More
CoWoS® (Chip-on-Wafer-on-Substrate) Services
TSMC CoWoS® services uses Through Silicon Via (TSV) technology to integrate multiple chips into a single device...More
Testing Services
TSMC began providing testing services in the late 1980's and, over time, has expanded its services to cover not only memory, logic and mixed-mode...More
Integrated Backend Services
TSMC helps customers manage their entire supply chain, from silicon wafer processing, bumping, wafer sort...More
 
TSMC February 2017 Revenue Report(2017/03/10)
   
TSMC Recognizes Outstanding Suppliers at Supply Chain Management Forum(2017/02/23)
   
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