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TSMC’s industry-leading Integrated Fan-Out (InFO) advanced packaging technology offers the most competitive size, radiation protection, costs, and performance characteristics. It provides highly flexible integration for active and passive chip components in an easy and convenient format.

InFO technology is particularly suitable for the integration of wireless systems that require low power consumption, good heat dissipation, compact size, and high bandwidths, for applications including smartphone, tablet, and IoTs.

In 2015, TSMC InFO packaging technology successfully integrated 16nm SoCs and DRAM in an advanced mobile application. Volume production of this technology started in the first half of 2016. Currently, the Company is developing InFO packaging technology for the 10nm, 7nm, and more advanced nodes.
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