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Integrated Backend Services    
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Integrated Backend Services
Open Innovation Platform®
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TSMC helps customers manage their entire supply chain, from silicon wafer processing, bumping, wafer sort, assembly, final test to IC component shipping.

TSMC is focused on advanced silicon and packaging integrations including:

Dielectric materials (Low-K, ELK, etc.)
Bump interconnect (SnAg, Cu bump, etc.)
Package bill-of-materials (underfill, molding, compound, substrate, etc.)
Silicon design for package/chip performance enhancement

TSMC offers a comprehensive set of integrated backend solutions for advanced packaging and test to help customers achieve shorter time-to-market and time-to-volume.

For more information about our Integrated Backend Services, please contact our Regional Sales Office or your Account Manager.
TSMC April 2017 Revenue Report(2017/05/10)
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