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Integrated Backend Services    
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Wafer Bumping Services
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CoWoS® (Chip-on-Wafer-on-Substrate) Services
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Integrated Backend Services
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In addition to in-house CoWoS and InFO services, TSMC also offers integrated turnkey services to its customers by managing the entire supply chain via outsourced assembly and test partners. The service includes silicon wafer fabrication, wafer bumping, wafer sort, assembly, final test, and shipping. Such comprehensive service helps customers achieve shorter time-to-market and time-to-volume.



TSMC Chairman Dr. Morris Chang Honored by Forbes Magazine as One of the World’s 100 Greatest Living Business Minds(2017/09/21)
   
Xilinx, Arm, Cadence, and TSMC Announce World’s First CCIX Silicon Demonstration Vehicle in 7nm Process Technology(2017/09/11)
   
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