Home > Dedicated IC Foundry > Services > TSMC Backend Services > Integrated Backend Services
Integrated Backend Services    
Grand Alliance
Open Innovation Platform®
Service Guide
Mask Services
TSMC Backend Services
Wafer Bumping Services
Wafer Level Chip Scale Package Services
CoWoS® (Chip-on-Wafer-on-Substrate) Services
InFO (Integrated Fan-Out) Services
Testing Services
Integrated Backend Services
Manufacturing Excellence
TSMC helps customers manage their entire supply chain, from silicon wafer processing, bumping, wafer sort, assembly, final test to IC component shipping.

TSMC is focused on advanced silicon and packaging integrations including:

Dielectric materials (Low-K, ELK, etc.)
Bump interconnect (SnAg, Cu bump, etc.)
Package bill-of-materials (underfill, molding, compound, substrate, etc.)
Silicon design for package/chip performance enhancement

TSMC offers a comprehensive set of integrated backend solutions for advanced packaging and test to help customers achieve shorter time-to-market and time-to-volume.

For more information about our Integrated Backend Services, please contact our Regional Sales Office or your Account Manager.
TSMC NCTU Collaborate on「TSMC/NCTU Energy Enducation Center」(2017/04/21)
TSMC Files Annual Report on Form 20-F for 2016(2017/04/13)
Media Contacts
Open Innovation Platform®
Tech Symposiums, Trade Shows, Industry Events & Investor Meetings
TSMC Value Chain Aggregator
Business Contacts
Document Center
TSMC-Onlinenew window
Online information and transaction for our customers.
The web-based portal for smarter supplier interactions.
Member Login
Join TSMC member to get the latest press releases and financial reports.
Find more information about TSMC.
Open Innovation Platform® Home     Contact Us     Site Map     FAQ     Legal Notice & Trademark Information     Privacy Policy
Copyright© Taiwan Semiconductor Manufacturing Company Limited 2010-2017, All Rights Reserved.