Home > Dedicated IC Foundry > Services > TSMC Backend Services > Wafer Bumping Services
Wafer Bumping Services    
Technology
Services
Grand Alliance
Open Innovation Platform®
Service Guide
Design
CyberShuttle®
Mask Services
TSMC Backend Services
Wafer Bumping Services
Wafer Level Chip Scale Package Services
CoWoS® (Chip-on-Wafer-on-Substrate) Services
Testing Services
Integrated Backend Services
eFoundry®
Manufacturing Excellence

TSMC offers various leading edge wafer bumping processes:

Bump Material Eutectic Lead Free Cu
Bump Composition (Plated) PbSn SnAg Cu /SnAg Cap
Adv. Si node (Qualified) 28nm 28nm 28nm
Available Wafer Sizes 12" 12" 12"
Max. Chip Size (mm2) <650 <400 <225
(<650 in 2H'13)
Min. Bump Pitch (um) 150 140 80
Re-distribution layer Yes Yes Yes
Polyimide Yes Yes Yes
Wafer Thickness (mil) ≥29 (FCBGA) 4~12 (FCCSP)
≥29 (FCBGA)
4~12 (FCCSP)
≥29 (FCBGA)
EM Performance
(max current density per bump)
1X 1.2X 2X
Environmental Friendliness No Yes Yes


TSMC Bumping Service Benefits:

Time-to-Market
TSMC's chip-to-package process interaction assessment saves months on flip chip technology development.
Capacity Management
TSMC's integrated operation streamlines planning and simplifies supply chain management.
Cycle time Control
TSMC has built a reputation for integrating wafer and bumping processes to fit multiple outsource assembly and test (OSAT) strategies.
TSMC NCTU Collaborate on「TSMC/NCTU Energy Enducation Center」(2017/04/21)
   
TSMC Files Annual Report on Form 20-F for 2016(2017/04/13)
   
Media Contacts
Open Innovation Platform®
Tech Symposiums, Trade Shows, Industry Events & Investor Meetings
TSMC Value Chain Aggregator
Business Contacts
Document Center
TSMC-Onlinenew window
Online information and transaction for our customers.
The web-based portal for smarter supplier interactions.
Member Login
Join TSMC member to get the latest press releases and financial reports.
Find more information about TSMC.
Open Innovation Platform® Home     Contact Us     Site Map     FAQ     Legal Notice & Trademark Information     Privacy Policy
Copyright© Taiwan Semiconductor Manufacturing Company Limited 2010-2017, All Rights Reserved.