Home > Dedicated IC Foundry > Services > TSMC Backend Services > Wafer Level Chip Scale Package Services
Wafer Level Chip Scale Package Services    
Grand Alliance
Open Innovation Platform®
Service Guide
Mask Services
TSMC Backend Services
Wafer Bumping Services
Wafer Level Chip Scale Package Services
CoWoS® (Chip-on-Wafer-on-Substrate) Services
Testing Services
Integrated Backend Services
Manufacturing Excellence
TSMC's Wafer Level Chip Scale Package (WLCSP) portfolio meets the growing demand for fully integrated assembly and test solutions.

WLCSP services utilize industry-standard surface mount assembly techniques to achieve the many cost-saving benefits associated with other JEDEC standard area array packages. Current product applications include Bluetooth, WLAN, cellular RF, handset audio, UWB, mobile TV, power management IC, codec and touch screen controllers.

Parameter Specification
Technology Nodes C130 - N28
Si/Package Codesign Environment Yes
Testing Yes
Available Wafer Sizes 12"
Max. Chip Size (mm2) 52
Min. Ball Pitch (μm) 350
Mask Schemes 3-mask & 4-mask
Wafer Thickness (mil) ≥12
Min. Cu RDL width/space (μm) 10/10
Environmental Friendliness Yes
Service Scope Shuttle & Production
Product Applications Cellular RF, Wi-Fi, Codec, Bluetooth, GPS

TSMC WLCSP Service Benefits:

Early engagement that speeds advanced technology migration.
High Quality
TSMC controls its WLCSP process through the same quality standards in its world class wafer fabs.
Capacity Management
TSMC plans WLCSP capacity based on silicon demand to streamline finished goods planning and simplify supply chain logistics.
Fast Yield Feedback
Concurrent silicon-to-package engineering drives constant yield improvement data.

TSMC NCTU Collaborate on「TSMC/NCTU Energy Enducation Center」(2017/04/21)
TSMC Files Annual Report on Form 20-F for 2016(2017/04/13)
Media Contacts
Open Innovation Platform®
Tech Symposiums, Trade Shows, Industry Events & Investor Meetings
TSMC Value Chain Aggregator
Business Contacts
Document Center
TSMC-Onlinenew window
Online information and transaction for our customers.
The web-based portal for smarter supplier interactions.
Member Login
Join TSMC member to get the latest press releases and financial reports.
Find more information about TSMC.
Open Innovation Platform® Home     Contact Us     Site Map     FAQ     Legal Notice & Trademark Information     Privacy Policy
Copyright© Taiwan Semiconductor Manufacturing Company Limited 2010-2017, All Rights Reserved.