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TSMC launched the semiconductor industry’s first 0.13-micron (µm) low-k, copper system-on-a-chip (SoC) process technology. The Company insisted on building its own R&D capabilities and made a key decision early on that contributed to this success when it declined a joint development invitation from a well-known IDM (Integrated Device Manufacturer). TSMC based its R&D team at the Company’s Hsinchu headquarters and successfully developed the technology ahead of IDMs and other foundries. This accomplishment not only marked Taiwan’s capability to develop advanced technology but also became a cornerstone for growing Taiwan’s semiconductor industry.

TSMC’s 0.13µm SoC low-k copper technology integrates multiple world-class SoC CMOS transistor process platforms, ultra-small SRAM memory (2.43-1.87 square µm), the world’s latest 193nm lithography, and the world’s first eight-layer low-k (k<=2.9) copper wire. Today, it sees broad application in consumer electronics, computers, mobile computing, automotive electronics, IoT, and smart wearables.

Cu/Low-K Technology

RC delay is one of the many challenges faced by the semiconductor process parasitic circuit in advancing into the more advanced nodes. Two approaches have been adopted to tackle this challenge: one is employing low resistance copper wires to replace conventional aluminum counterpart of higher resistance and the other is employing material with lower dielectric constant k, i.e. the so-called Cu/low-k technology.

SoC (System-on-a-Chip) Technology

The SoC technology integrates various process technologies on a single silicon chip including logic, cache memory, analog, radio frequency (RF), and non-volatile memory to integrate a complete electronic system on a single chip. Such high integration can maximize efficiency and reduce cost significantly.

The System on Chip (SoC) technology is used for a wide spectrum of applications including mobile devices, computing, consumer electronics, car electronics, IoT, and smart wearables.

TSMC May 2017 Revenue Report(2017/06/09)
TSMC Sets July 2 as Record Date for Common Share Dividends(2017/06/08)
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