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TSMC became the world's first semiconductor company that begins 20nm volume production, using its innovative double patterning technology, in 2014.

The 20nm technology provides better density and power value than previous technology nodes, due to using energy-efficient transistors and interconnects and world's leading double patterning technique. Compared to its 28nm node, the 20nm process provides 15% better performance and can reduce total power consumption by a third. It is ideal for both performance-driven products and mobile computing application migration.

Double Patterning Technology

TSMC introduces the world's first double patterning technology. This world-leading technology marks a significant milestone for pushing the semiconductor technology forward. Before the readiness of the next patterning technology, for example, the Extreme Ultraviolet (EUV), double patterning technology can achieve required resolution by exposing IC design patterns on the wafer twice.

Other 20nm milestones :

2012: Release the 20nm and CoWoS® design reference flows to assist customers with next generation chip design
2012: Begin customer test chip manufacturing with the 20nm System-on-Chip process technology
2011: Complete the world's first 20nm tape-out of ARM's Cortex-A15 core processor. TSMC's 20nm process technology provides high performance computing capability and low power consumption, making it ideal for smartphones, tablets, laptop computers, high-end household electronics, servers, and wireless infrastructure applications.
TSMC February 2017 Revenue Report(2017/03/10)
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