TSMC has always insisted on building a strong, in-house R&D capability. As a global semiconductor technology leader, TSMC provides the most advanced and comprehensive portfolio of dedicated foundry process technologies.
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A14 Technology
A14 technology is TSMC’s next cutting-edge logic process that achieves full-node power, performance and area through dimensional scaling. A14 is designed to drive AI transformation forward by delivering...
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A16 Technology
TSMC A16™ technology integrates leading nanosheet transistors with innovative backside power rail solution, bringing greatly improved logic density and performance. Backside power rail improves logic density...
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2nm Technology
TSMC’s 2nm (N2) technology has started volume production in 4Q25 as planned. N2 technology features industry-leading first-generation nanosheet transistor technology, with full-node strides in performance...
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3nm Technology
In 2022, TSMC became the first foundry to move 3nm FinFET (N3) technology into high-volume production. N3 technology is the industry’s most advanced FinFET technology, offering the best performance, power...
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5nm Technology
In 2020, TSMC became the first foundry to move 5nm FinFET (N5) technology into volume production and enabled customers’ innovations in smartphone and high-performance computing (HPC) applications...
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7nm Technology
In 2018, TSMC became the first foundry to start 7nm FinFET (N7) volume production.The N7 technology is one of TSMC’s fastest technologies to reach volume production and provides optimized manufacturing processes...
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16nm Technology
In 2013, TSMC became the first foundry to begin 16nm Fin Field Effect Transistor (FinFET) technology risk production and later in 2014, the first foundry to deliver a fully functional 16nm FinFET customer...
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22nm Technology
The 22nm Ultra-Low Power (22ULP) process technology is derived from TSMC's industry-leading 28nm technology. It delivers enhanced performance and cost efficiency, making it suitable for applications such...
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28nm Technology
In 2011, TSMC became the first foundry that provided 28nm general purpose process technology. Following this, TSMC continued to expand its 28nm technology offerings and offered the foundry’s most comprehensive...
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40nm Technology
TSMC led the foundry segment to start the volume production of a variety of products for multiple customers using its 40nm process technology in 2008. The 40nm process integrated 193nm immersion lithography...
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65nm Technology
TSMC became the first foundry to begin 65nm risk production in 2005 and passed product certification the following year. The Company also introduced foundry’s first 65nm Low Power (LP) process to meet...
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90nm Technology
TSMC became the first semiconductor company to produce fully-functional 90nm chips using immersion lithography technology. The Company announced the accomplishment at SEMICON Japan in December 2004...
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0.13µm Technology
TSMC launched the semiconductor industry's first 0.13µm low-k, copper system-on-chip (SoC) process technology. The Company insisted on building its own R&D capabilities and made a key decision early on that...
TSMC launched the semiconductor industry's first 0.13µm low-k, copper system-on-chip (SoC) process technology. The Company insisted on building its own R&D capabilities and made a key decision early on that contributed to this success when it declined a joint development invitation from a well-known integrated device manufacturer (IDM). TSMC based its R&D team at the Company's Hsinchu headquarters and successfully developed the technology ahead of IDMs and other foundries. This accomplishment not only marked Taiwan's capability to develop advanced technology but also became a cornerstone for growing Taiwan's semiconductor industry.
TSMC's 0.13µm SoC low-k copper technology integrates multiple world-class SoC CMOS transistor process platforms, ultra-small SRAM memory (2.43-1.87 square µm), the world's latest 193nm lithography, and the world's first eight-layer low-k (k≤2.9) copper routing. Today, it sees broad applications in consumer electronics, computers, mobile computing, automotive electronics, IoT, and smart wearables.
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0.18µm Technology
TSMC’s 0.18μm logic technology marked a significant milestone in semiconductor manufacturing and today provides a reliable and proven solution for a wide range of applications. This mature process node strikes...
