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TSMC became the first foundry to begin 65nm risk production in 2005 and passed product certification the following year. The Company also introduced foundry’s first 65nm Low Power (LP) process to meet customers’ needs.

Following the 65nm LP process, TSMC quickly introduced a broad process portfolio that includes: general purpose (G), mixed signal/radio frequency (MS/RF), embedded DRAM memory (eDRAM), multi-time programmable non-volatile memory (MNVM), embedded flash memory (eFLASH), high voltage (HV), power management (BCD), and MEMS processes. The 65nm technology target for a wide range of applications, such as mobile devices, computers, automotive electronics, IoT, and smart wearables.

TSMC’s 65nm technology is the Company’s third-generation semiconductor process employing both copper interconnects and low-k dielectrics. The technology supports a standard cell gate density twice that of TSMC’s 90nm process. It offers better integration, improves chip performance and significantly reduces power consumption, with its innovative power management technology.

Other 65nm process technology milestones:

2015: The 55nm Ultra-Low Power (55ULP) process technology (a 65nm shrink) enters production. This technology significantly increases battery life. The 55ULP also integrates RF and Embedded Flash capabilities to enable customers’ SoC designs with smaller form factors
2013: The 65nm/55nm Embedded Flash, NOR-based cell technologies (1-T cell and Split-Gate cell) completes customer qualification. This technology supports automotive and consumer electronic products
2012: The 65nm Split-Gate cell technology is qualified and enters production for automotive applications
2009: TSMC offers a 65nm multi-time programmable non-volatile memory progress technology
2008: TSMC’s 65nm embedded DRAM process technologies complete qualification for high-speed and low-power applications and enter volume production
2007: The 65nm MS/RF low-power process completes qualification and moves into volume production
2006: TSMC successfully produces foundry’s first functional 65nm embedded DRAM customer product

TSMC April 2017 Revenue Report(2017/05/10)
TSMC Board of Directors Meeting Resolutions(2017/05/09)
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