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TSMC provides foundry’s most comprehensive and competitive Bipolar-CMOS-DMOS (BCD) Power Management process technologies and is also the first foundry to adopt 300mm wafer production for the BCD Power Management process.

TSMC BCD Power Management process features higher integration, smaller footprint, lower power consumption, covering nodes from 0.6µm to 0.13µm. Customers chips produced by the process provide more stable and efficient power supplies that consume less energy, ideal for applications including consumer electronics, communication devices, and computers.

TSMC’s 12-inch 0.13μm BCD Plus technology, which provides superior cost competitiveness compared to the prior 0.13μm BCD technology, passed process validation by customers and started production in the second half of 2017.

In addition, 0.18μm BCD third generation, which provides superior cost competitiveness compared to the second generation, also passed process validation by customers and started volume production in the second half of 2017.
TSMC September 2018 Revenue Report(2018/10/09)
   
TSMC Announces 5th Open Innovation Platform® Alliance, the OIP Cloud Alliance(2018/10/03)
   
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