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TSMC provides foundry's most comprehensive and competitive Bipolar-CMOS-DMOS (BCD) Power Management process technologies and is also the first foundry to adopt 300mm wafer production for the BCD Power Management process.

TSMC BCD Power Management process features higher integration, smaller footprint, lower power consumption, covering nodes from 0.6µm to 0.13µm. Customers' chips produced by the process provide more stable and efficient power supplies that consume less energy, ideal for applications including consumer electronics, communication devices, and computers.

The Company launched its 3rd generation 0.18µm BCD Power Management technology in 2016. It employs a TSMC exclusive component structure to offer industry-leading overall performance to meet mobile device demands for lower power consumption with more effective costs. TSMC BCD technology also passed Auto mobile AEC-Q100 qualification in 2017. Meanwhile, the next 8" 90nm BCD technology is stably developing that will keep TSMC's leadership and best competition in the world.
TSMC June 2018 Revenue Report(2018/07/10)
TSMC Dedicates Headquarters as “Morris Chang Building”(2018/07/10)
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