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Leading Edge Technology
16nm Technology
20nm Technology
28nm Technology
40nm Technology
Advanced 12-inch Technology
More-than-Moore Technology
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TSMC is dedicated to developing leading edge technology that provides the foundation for semiconductor innovation. TSMC's leading edge processes combine advanced 193nm immersion photolithography, performance-enhancing silicon strain technology, and extreme low-k (ELK) inter-metal dielectric materials to support both the performance and reliability required by today's advanced technology designs.

16nm Technology
In November 2013, TSMC became the first foundry to begin 16nm FinFET risk production. In addition, TSMC became the first foundry that produced the industry’s first 16nm FinFET fully functional networking processor for its customer...More

20nm Technology
TSMC became the world’s first semiconductor company that begins 20nm volume production, using its innovative double patterning technology, in 2014...More

28nm Technology
TSMC became the first foundry to provide the world’s first 28nm General Purpose process technology in 2011 and has been adding more options ever since...More

40nm Technology
TSMC became the first foundry to mass produce a variety of products for multiple customers using its the 40nm process technology in 2008...More
TSMC Board of Directors Proposes NT$8 Cash Dividend per Share(2018/02/13)
TSMC Announces Relief Plan for Hualien Earthquake Victims(2018/02/12)
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