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TSMC has always insisted on building a strong, in-house R&D capability. As a global semiconductor technology leader, TSMC provides the most advanced and comprehensive portfolio of dedicated foundry process technologies.

5nm Technology
TSMC’s 5nm Fin Field-Effect Transistor (FinFET) process technology is optimized for both mobile and high performance computing applications. It is scheduled to start risk production in the second half of 2019...More

7nm Technology
TSMC’s 7nm Fin Field-Effect Transistor (FinFET) process technology provides the industry’s most competitive logic density and sets the industry pace for 7nm process technology development by delivering 256Mb SRAM...More

10nm Technology
TSMC’s 10nm Fin Field-Effect Transistor (FinFET) process provides the most competitive combination of performance, power, area, and delivery parameters. The Company began accepting customer tape-outs for its 10nm FinFET process...More

16/12nm Technology
In November 2013, TSMC became the first foundry to begin 16nm Fin Field Effect Transistor (FinFET) risk production. In addition, TSMC became the first foundry that produced the industry’s first 16nm FinFET...More

20nm Technology
TSMC became the world’s first semiconductor company that begins 20nm volume production, using its innovative double patterning technology, in 2014, and made record of TSMC’s fastest ramping node in the same year...More

28nm Technology
TSMC became the first foundry to provide the world’s first 28nm General Purpose process technology in 2011 and has been adding more options ever since. TSMC provides customers with foundry’s most comprehensive 28nm process...More

40nm Technology
TSMC became the first foundry to mass produce a variety of products for multiple customers using its 40nm process technology in 2008. The 40nm process integrates 193nm immersion lithography technology and ultra-low-k connection material...More

65nm Technology
TSMC became the first foundry to begin 65nm risk production in 2005 and passed product certification the following year. The Company also introduced foundry’s first 65nm Low Power (LP) process to meet customers’ needs...More

90nm Technology
TSMC became the first semiconductor company to produce fully-functional 90nm chips using immersion lithography technology. The Company announced the accomplishment at SEMICON Japan in December 2004...More

0.13-micron Technology
TSMC launched the semiconductor industry’s first 0.13-micron (µm) low-k, copper system-on-a-chip (SoC) process technology. The Company insisted on building its own R&D capabilities...More

0.18-micron Technology
TSMC offered the world’s first 0.18-micron (µm) low power process technology in 1998. The Company continued to build its technology leadership by rolling out new low power processes every two years...More

3-micron Technology
TSMC has persistently maintained a “building in-house R&D” strategy since its founding in 1987, which has given the company significant competitive advantages...More
TSMC November 2018 Revenue Report(2018/12/10)
   
TSMC Recognizes Outstanding Suppliers at Supply Chain Management Forum(2018/12/06)
   
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