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TSMC introduced the world's first Sensor SoC process technology in 2011. This technology manufactures monolithic Micro Electro Mechanical Systems (MEMS) by integrating TSMC's industry-leading Complementary Metal-Oxide-Semiconductor (CMOS) and wafer stacking technologies.

TSMC Sensor SoC technology ranges from 0.5-micron (µm) to 0.11µm and supports applications including G-Sensors, gyroscopes, MEMS microphones, pressure gauges, microfluidic, and biological gene chips.

TSMC introduced the world's first Si-pillar WLCSP (wafer level chip scale packaging) technology in 2016. This technology can be applied to customers'CMOS-MEMS (micro-electromechanical systems) motion sensor SoC designs, creating the world's smallest packaging dimension, as small as 1.1mm by 1.3mm, only about one-fifth of the size compared to the traditional packaging.
TSMC June 2018 Revenue Report(2018/07/10)
TSMC Dedicates Headquarters as “Morris Chang Building”(2018/07/10)
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