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300mm Wafer

TSMC currently operates two 300-mm GigaFabs (Fabs 12 and Fab 14). The combined capacity of the two GigaFabs reached 271,000 wafers by the end of 2006. Production within these two facilities supports 0.13-micron, 90nm, 65nm and 45nm process technologies. Part of the capacity is reserved for research and development work and currently supports 32nm and beyond technology development.

GigaFabs demonstrate TSMC's unceasing effort to improve manufacturing excellence and deliver manufacturing breakthroughs. GigaFabs attain lower operating costs by achieving near 100 percent automation, including real-time wafer dispatching, automated materials handling systems (AMHS) search engines to optimizedroutes , full automation of production wafers and non-product wafers, and a lean work-in-progress control.

GigaFabs not only have inherent volume advantages over smaller facilities, but also they:

	Improve product quality and yields
	Accelerate yield learning and time to volume
	Shorten production cycle times
	Minimize costly product re-qualification