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| コーポレート エグゼクティブ |
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Education:
Ph.D., Electrical Engineering, Stanford University, USA
Experience:
Chief Executive Officer, TSMC
Chairman, Industrial Technology Research Institute
President & COO, General Instrument Corporation |
Dr. Morris Chang is the founding Chairman and Chief Executive Officer of Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), which pioneered the "Dedicated IC Foundry" business model. Prior to his career in Taiwan, Dr. Chang was the President and COO of General Instrument Corp. in 1984-1985 and Group Vice President at Texas Instruments in 1958-1983.
Dr. Chang received his B.S. and M.S. degrees in Mechanical Engineering from Massachusetts Institute of Technology, and his Ph.D. in Electrical Engineering from Stanford University. He has received honorary doctorates from seven universities.
Dr. Chang received 2011 IEEE Medal of Honor, the EE Times Lifetime Achievement Award in 2009; the highest honor of the Semiconductor Industry Association (USA), its Robert N. Noyce Award in 2008; the Nikkei Asia Prize in 2005; the IEEE Robert N. Noyce Award in 2000; and the "Exemplary Leadership Award" of the Fabless Semiconductor Association (FSA) in 1999.
Dr. Chang is a Life Member Emeritus of M.I.T Corporation, Member of the National Academy of Engineering, Trustee of the Eisenhower Foundation, and Fellow of Computer History Museum. |
Education:
Ph.D., Electrical Engineering, National Cheng-Kung University, Taiwan
Experience:
President, TSMC
President, Vanguard International Semiconductor Corp. |
Dr. F.C. Tseng is the Vice Chairman of TSMC. Prior to his appointment, Dr. Tseng served as Deputy Chief Executive Officer, President, and Senior Vice President of Operations. Dr. Tseng also spent two years as President of Vanguard International Semiconductor Corporation (VIS), which spun out from the Industrial Technology Research Institute's (ITRI) Sub-micron Process Technology Development Project and was Taiwan's first eight-inch IC facility.
Dr. Tseng led 110 specialists to spin off from ITRI's Electronics Research & Service Organization (ERSO), and in 1987 co-founded TSMC as a pioneer specializing in the "foundry only" semiconductor manufacturing business. Dr. Tseng established a solid technical base for TSMC's six-inch and eight-inch fabs.
From 1973 to 1986, Dr. Tseng served at ITRI-ERSO. In 1978, Dr. Tseng was promoted to plant manager of the IC demonstration plant, where he was responsible for the production and development of silicon-gate CMOS. Under his supervision, ITRI established the capability to develop an advanced CMOS process.
Dr. Tseng holds a Ph.D. degree in electrical engineering from National Cheng Kung University in Taiwan, and he was named one of the "Ten Outstanding Engineers" by the Chinese Institute of Engineers in 1991. |
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リック・ツァイ |
チェアマン& CEO
TSMCソーラー/TSMCソリッド・ステート・ライティング(SSL)
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Education:
Ph D., Material Science, Cornell University, USA
Experience:
President of New Businesses, TSMC
President and Chief Executive Officer, TSMC
President and Chief Operating Officer, TSMC
Executive Vice President, Worldwide Marketing and Sales, TSMC
President, Vanguard International Semiconductor Corp. |
Dr. Rick Tsai serves as Chairman and Chief Executive Officer of two TSMC wholly-owned subsidiaries, TSMC Solar Ltd. and TSMC Solid State Lighting Ltd., and works to cultivate new revenue sources outside of the company's core IC foundry business. Before taking these positions in August 2011, he was TSMC's President of New Businesses and previously served as President and Chief Executive Officer from 2005 to 2009.
Since joining TSMC in 1989, Dr. Tsai has held many key executive positions including chief operating officer, executive vice president of Worldwide Sales and Marketing, and executive vice president of Operations. Dr. Tsai was also appointed President of TSMC affiliate Vanguard International Semiconductor from 1999 to 2000.
Prior to joining TSMC, Dr. Tsai rose through the managerial and technical ranks during his 8 years at Hewlett-Packard in Ft. Collins, Colo., including R&D Project Manager, Manufacturing Engineering Project Manager, and as a member of the technical staff. His responsibilities at Hewlett-Packard included 1-micron CMOS VLSI process integration; yield improvement, process development and process reliability.
Dr. Tsai received his B.S. degree in physics from National Taiwan University in Taiwan and holds a Ph.D. degree in material science and engineering from Cornell University in Ithaca, N.Y. |
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| シャンイー・チャン |
| エグゼクティブ・バイス・プレジデント & Co-COO |
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Education:
Ph.D., Electrical Engineering, Stanford University, USA
Experience:
Senior Vice President, Research and Development, TSMC
Chairman, VisEra Technologies Company
Chairman, Xintec Inc. |
Dr. Shang-yi Chiang is TSMC's Executive Vice President and Co-Chief Operating Officer. Dr. Chiang joined TSMC in July 1997 as Vice President of Research and Development (R&D). He retired from TSMC as Senior Vice President of R&D in July 2006 and returned in September 2009.
Prior to TSMC, Dr. Chiang spent 17 years at Hewlett Packard Company, where he held a variety of engineering and management positions in both R&D and manufacturing. Previously, he worked at Texas Instruments and ITT Corporation. During his 30+ years in the semiconductor industry, he has been engaged in the research and development of CMOS, NMOS, Bipolar, SOS, SOI, GaAs lasers, LED, E-Beam lithography, and silicon solar cells.
Dr. Chiang, a fellow of IEEE, received his Bachelor of Science degree from National Taiwan University, his Master of Science degree from Princeton University, and his Doctorate from Stanford University, all in electrical engineering. |
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| マーク・リュウ |
| エグゼクティブ・バイス・プレジデント & Co-COO |
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Education:
Ph.D., Electrical Engineering and Computer Science, University of California, Berkeley, USA
Experience:
Senior Vice President, Operations, TSMC
Senior Vice President, Advanced Technology Business, TSMC
Vice President, South-Site Operation, TSMC
President, Worldwide Semiconductor Manufacturing Corp. |
Dr. Mark Liu is TSMC's Executive Vice President and Co-Chief Operating Officer. Prior to his current position, he served as Senior Vice President of Operations. Dr. Liu joined TSMC in 1993 as an Engineering Manager and rejoined TSMC in 2000, when as president of Worldwide Semiconductor Manufacturing Company; the company was acquired by TSMC.
Dr. Liu has served in a number of technical capacities first with AT&T Bell Laboratories as a principal investigator in the High Speed Electronics Research and later at Intel Corporation where developed process technologies for Intel's 32-bit microprocessors and flash memory products.
He is a member of Board of Directors of Silicon System Manufacturing Company in Singapore. He received the B.S. degree in electrical engineering from National Taiwan University and his M.S. and Ph.D. degrees in electrical engineering and computer science from University of California, Berkeley. |
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| シーシー・ウェイ |
| エグゼクティブ・バイス・プレジデント & Co-COO |
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Education:
Ph.D., Electrical Engineering, Yale University, USA
Experience:
Senior Vice President, Business Development, TSMC
Senior Vice President, Mainstream Technology Business, TSMC
Vice President, South Site Operation, TSMC
Senior Vice President, Technology, Chartered Semiconductor Manufacturing Ltd. |
Dr. C. C. Wei joined TSMC in 1998 and currently serves as Executive Vice President and Co-Chief Operating Officer. Prior to his recent appointment, Dr. Wei was TSMC's Senior Vice President of Business Development.
Before joining TSMC, he was Senior Vice President of Technology at Chartered Semiconductor and Senior Manager, Logic and SRAM technology development at ST Microelectronics. He also served as a member of the technical staff at Texas Instruments.
Dr. Wei was awarded his PhD by Yale University. |
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| スティーブ・ツォー |
| シニア・バイス・プレジデント & CIO |
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Education:
Ph.D., Materials Science and Engineering, University of California, Berkeley, USA
Experience:
President, WaferTech, LLC, Camas, USA
Senior Vice President, Operations, TSMC
Senior Vice President, Worldwide Marketing & Sales, TSMC |
Dr. Steve Tso is TSMC's Senior Vice President and Chief Information Officer. Prior to his current position, Dr. Tso served as President of TSMC's Wafertech affiliate in Camas, Washington.
Dr. Tso joined TSMC in 1996 as the Vice President of R&D. He was later the Senior Vice President of World Wide Marketing & Sales and Vice President of Operations Prior to joining TSMC, Dr. Tso served as General Manager of Applied Materials CVP products, Vice President of operations at SGS-Thomson and as a Fab Manager for Texas Instruments.
Dr. Tso received the B.S. degree in Physics from National Taiwan University and his M.S. and Ph.D degrees in Materials Science and Engineering from University of California, Berkeley. |
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| リチャード・サーストン |
| シニア・バイス・プレジデント & ジェネラル・カウンセル |
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Education:
J.D. Rutgers School of Law, State University of New Jersey, USA
Ph. D., History, University of Virginia, USA
Experience:
Vice President and General Counsel, TSMC
Partner, Haynes Boone, LLP
Vice President Corporate Staff, Assistant General Counsel, Texas Instruments Incorporated |
Dr. Richard Thurston is Senior Vice President and General Counsel of TSMC and is responsible for legal and intellectual property management. Dr. Thurston is famous for his global experience in commercial, technology and international law.
Prior to joining TSMC, Dr. Thurston was a Partner at Kelt Capital Partners, LP, and a member of Haynes and Boone. His practice covered general corporate matters, technology-related transactions, mergers and acquisitions, joint ventures and divestitures, venture capital investments, foreign trade and investment, and the global protection of intellectual property rights.
Before Dr. Thurston joined Haynes and Boone, he served as the Regional Counsel, Asia Pacific and Vice President, Corporate Staff, and Assistant General Counsel for 12 years at Texas Instruments, where he was responsible for legal and M&A activities throughout the Asia Pacific region.
Dr. Thurston graduated Cum Laude with a B.A. degree in History from Alma College, and an M.A. degree and a Ph.D. degree in East Asian Studies from University of Virginia. He received a J.D. degree from Rutgers School of Law. Dr. Thurston also studied R.O.C. Law at Soochow University. |
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| ローラ・ホ |
| バイス・プレジデント & CFO / スポークスマン |
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Education:
EMBA, National Taiwan University, Taiwan
Experience:
Vice President, Chief Financial Officer and Spokesperson, TSMC
Vice President, TI-Acer Semiconductor Manufacturing Corp. |
Lora Ho is the Chief Financial Officer and Spokesperson of Taiwan Semiconductor Manufacturing Company Limited (TSMC).
Joined TSMC in 1999, Ms. Ho served as Corporate Controller from 1999 to 2003, and became the Chief Financial Officer since 2003. Prior to TSMC, Ms. Ho served various positions in Accounting and Finance field in Foreign invested companies.
Ms. Ho was awarded " Outstanding Financial Executive " for the year of 1993 by Financial Executives Institute, The " Best Companies' Best CFO " of Taiwan from 2007-2010 by FinanceAsia , also the Best CFO in Asia in 2011 by Institutional Investor.
Ms. Ho received her MBA degree from National Taiwan University in 2003 and a B.A. degree from National Cheng-chi University in 1978. |
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| ジェイソン・チェン |
シニア・バイス・プレジデント
ワールドワイドセールス&マーケティング |
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Education:
MBA, University of Missouri, Columbia, USA
Experience:
Vice President, Worldwide Sales and Marketing, TSMC
Vice President & Co-Director, Sales & Marketing Group, Intel Corp. |
Mr. Jason Chen is TSMC's Senior Vice President of Worldwide Sales and Marketing. He joined TSMC in April 2005 as Vice President of Corporate Development, where he assisted with the company's business strategy and strategic planning.
Prior to joining TSMC, Mr. Chen worked at Intel for 14 years in a variety of sales and marketing positions. His last assignment was Vice President and Director, Sales and Marketing Group, where he was responsible for Intel's worldwide sales operations. Before joining Intel, Mr. Chen worked for IBM Taiwan and Copam Electronics.
Mr. Chen graduated from National Cheng-Kung University, Taiwan with a B.A. in Business Administration. He has been honored by the university's North American Alumni Association as an outstanding alumnus. He earned his MBA degree from the University of Missouri, USA. In 2001, Mr. Chen was selected by China Computerworld as one of the top 10 most powerful people in China's information technology industry. |
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| エムシー・ツェン |
バイス・プレジデント
Fab関連担当 |
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Education:
M.S., Applied Chemistry, Chung Yuan University, Taiwan
Experience:
Vice President, Mainstream Technology Business, Vice President Operations I, Senior Director Fab 2 Operations, TSMC |
Mr. M.C. Tzeng is TSMC's Vice President of Operations for Affiliate Fabs. Prior to this post, he served as Vice President of TSMC's Mainstream Technology Business. He joined the Company in 1987.
Prior to TSMC, Mr. Tzeng worked for ERSO/ITRI on IC process technology projects. Mr. Tzeng has compiled an extensive IC manufacturing background having held positions as a Process Engineer, Fab Section Manager, Fab Department Manager and Fab Senior Director. His in-depth knowledge covers both on process technology development and Fab operations.
Mr. Tzeng received his B.S. degree in Chemistry from Tamkang University and his M.S. degree in Applied Chemistry from Chung Yuan University. |
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| ウェイジェン・ロー |
バイス・プレジデント
製造技術担当 |
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Education:
Ph.D., Solid State Physics and Surface Chemistry, University of California, Berkeley, USA
Experience:
Vice President, Advanced Technology Business, TSMC
Vice President, Research & Development, TSMC
Vice President, Operation II, TSMC
Director, Advanced Technology Development & CTM Plant Manager, Intel |
Dr. Lo is TSMC's Vice President of Operations for Manufacturing Technology. Prior to this post, he served as Vice President of the Company's Advanced Technology Business.
Dr. Lo joined TSMC in 2004 as Vice President of Operations II and served as Vice President of Research & Development from 2006 to 2009.
Prior to joining TSMC, Dr. Lo was Director of Technology Development and Plant Manager with Intel Corporation's Technology and Manufacturing Group. From 1997 to 2000, he served a Factory Manager, responsible for running Intel's development factory in Santa Clara, California.
Dr. Lo has also worked at a number of U.S. universities, the Motorola Research and Development Lab and the Xerox Microelectronics Center.
Dr. Lo received his B.S. degree in physics from National Taiwan University and his M.S. and Ph.D. degrees in Solid State Physics and Surface Chemistry from University of California, Berkeley. |
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| ジャック・サン |
バイス・プレジデント & CTO
R&D担当 |
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Education:
Ph.D., Electrical Engineering, University of Illinois, USA
Experience:
Vice President, Research and Development, TSMC
Senior Director, Logic Technology Development Division, TSMC
R&D, International Business Machines |
Dr. Jack Sun has served as TSMC's Vice President of Research and Development since June of 2006 and as Chief Technology Officer since November 2009. During his career at TSMC, he has led the successful expansion and acceleration of the logic and Mixed-signal/RF technology roadmap and driven the development of advanced technology initiatives from the 0.18-micron node to today's leading edge 28nm process.
Prior to joining TSMC, Dr. Sun held a number of senior management and engineering positions at IBM Research and the IBM Semiconductor Research and Development Center for 14 years. He led many successful R&D projects that set world records and shaped industry trends in CMOS, SOI, low-power CMOS, low temperature CMOS, bipolar, and SiGe Hetero-junction Bipolar Transistors (HBT).
Dr. Sun received his BS degree from National Taiwan University, and MS and Ph.D. degree from the University of Illinois, all in Electrical Engineering. He is an IEEE Fellow in recognition of his significant contributions to CMOS technology. He has over 200 papers, 11 US patents, and several ROC patents. |
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| エヌエス・ツァイ |
バイス・プレジデント
品質保証担当 |
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Education:
Ph.D. , Materials Science, Massachusetts Institute of Technology, USA
Experience:
Senior Director, Quality & Reliability, TSMC |
Dr. N.S. Tsai, TSMC Vice President of Quality and Reliability, joined the company in 1989. As head of Quality and Reliability since 2004, Dr. Tsai has led the successful customer qualification of 90nm, 80nm, and 65nm technologies.
Over his career at TSMC, Dr. Tsai has a wide variety of positions in R&D, Operations, and Assembly & Testing. He was director of Fab 1 from 1993 to 1995, and served as director of Fab 4 from 1995 to 1997, where he established standard quality systems that made Fab 4 an outstanding manufacturing facility as well as TSMC's R&D development fab for several technology generations.
Dr. Tsai also established TSMC's first 12-inch pilot line and was responsible for evaluating and selecting production tools, developing automated manufacturing systems, and transitioning from eight-inch to 12-inch production. He also developed TSMC's flip chip technology and established TSMC's first 12-inch wafer bumping line when he was the head of Assembly & Test.
Before joining TSMC, Dr. Tsai served with AT&T's R&D department for 5 years.
Dr. Tsai earned his B.S. in Physics from National Tsinghua University, his M.S. degree in Physics from Temple University and his Ph.D. in Materials Science from Massachusetts Institute of Technology. |
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| ワイピー・チン |
バイス・プレジデント
オペレーション/商品開発担当 |
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Education:
M.S., Electrical Engineering , Electrical Engineering, National Cheng-Kung University, Taiwan
Experience:
Vice President, Advanced Technology Business, TSMC
Senior Director, Operations II, TSMC |
Mr. Y.P. Chin serves as TSMC's Vice President of Operations for Product Development. Prior to this post, he was Vice President of Advanced Technology Business in TSMC, sharing responsibility with Senior Vice President Dr. Mark Liu for TSMC's advanced technology and 300mm fab operations.
Mr. Chin joined TSMC when it was founded in 1987 and has made significant contribution to TSMC's product engineering capability throughout his career. He was Director of Fab 1 from 1997 to 1998, and in later positions helped manage yield improvement in all new generations of advanced technology, including 0.13-micron, 90nm, 65nm, and 45nm nodes. Mr. Chin pioneered the development of TSMC's Golden Spice Modeling methodology and Design For Manufacturing program.
Prior to joining TSMC, Mr. Chin worked as an engineer with the Industrial Technology Research Institute's Electronics Research and Service Organization (ERSO-ITRI).
Mr. Chin earned his B.S. and M.S. degrees in Electrical Engineering from National Cheng Kung University. |
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| リック・キャッシディー |
バイス・プレジデント
TSMCノースアメリカ プレジデント |
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Education:
B.A. Science degree in Engineering, United States Military Academy at West Point, USA
Experience:
Vice President of TSMC North America Account Management |
Rick Cassidy has been a major contributor to both the business and technical spheres of the semiconductor industry for nearly 30 years and has led many major contributions to the growth of the fabless business model.
Mr. Cassidy was appointed President, TSMC North America in January 2005 and was elected a Corporate Vice President, TSMC, Ltd. in November 2008. He has driven many of the strategic initiatives and business process improvements that helped TSMC achieve its current market position. Mr. Cassidy joined TSMC North America in 1997 as Vice President, Account Management. From 1999 to 2004, he served as Senior Vice President, Operations, instituting productivity and business process efficiencies that kept customers and the company on-course during one of the semiconductor industry's most turbulent times. He was then appointed Executive Vice President, TSMC North America in 2004.
Mr. Cassidy began his semiconductor industry career at Fairchild Semiconductor Company, which was later acquired by National Semiconductor in 1979. Over the next 15 years, he served in a broad range of ever-increasing responsibilities in manufacturing, engineering, quality and reliability, and marketing. In 1994, Mr. Cassidy was appointed Vice President and General Manager of National Semiconductor's Military & Aerospace Division, assuming responsibility for over 600 people.
Prior to entering the semiconductor industry, Mr. Cassidy served as an officer in the U.S. Army. He holds a Bachelor of Science degree in Engineering from the United States Military Academy at West Point. |
Education:
EMBA, Tulane University, USA
Experience:
Senior Director, Corporate Planning Organization, TSMC |
Mr. L.C. Tu was appointed as Vice President of Human Resources of TSMC in August 2009. He joined TSMC when it was founded in 1987.
From 1993 to 2003, Mr. Tu served as Fab Director of Fab3, Fab4, WaferTech, and Fab5. He made contributions to integrate CIM, SMIF, and manufacturing technology for cycle time and operation efficiency improvement. From 2003 and to 2009, Mr. Tu served as Senior Director of Corporate Planning. During that time, he established company-wide procedures for supply chain management, pricing, demand forecast, cost management, Capex planning and customer logistics support. He also enhanced the Company's planning efficiency through collaborative information technology implementation.
Prior to joining TSMC, Mr. Tu worked as an engineer with the Industrial Technology Research Institute's Electronics Research and Service Organization (ERSO-ITRI).
Mr. Tu earned his B.S. in Industrial Engineering from Chung Yuan University and his MBA from Tulane University. |
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| ジェイケー・リン |
バイス・プレジデント
オペレーション/メインストリームFab担当 |
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Education:
B.S. degree in Industrial Education & Technology, National Changhua University of Education
Experience:
Senior Director of Mainstream Fabs, TSMC
Fab12 Director, Fab6 Director, and Fab3 Director, TSMC |
Mr. J.K. Lin is TSMC's Vice President of Operations for Mainstream Fabs. Prior to this post, Mr. Lin served as Senior Director of Mainstream Fabs.
Mr. Lin joined TSMC when it was founded in 1987 and has held a number of manufacturing positions including Equipment Engineer, Section Manager, and Department Manager in Fab1 and 2. He was responsible for the construction of Fab 3 was later Fab Director of Fab 3, Fab 7, Fab 6, Fab 12, and Senior Director for 300mm Fabs. He worked in the Electronic Research and Service Organization (ERSO) of Taiwan's Industrial Technology Research Institute (ITRI) before joining TSMC.
Mr. Lin earned his B.S. degree from National Changhua University of Education. |
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| ジェイケー・ワン |
バイス・プレジデント
オペレーション/300mm Fab担当 |
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Education:
M.S., Chemical Engineering, National Cheng-Kung University, Taiwan
Experience:
Senior Director, Operations / 300mm Fabs, TSMC
Senior Director, 6" & 8" Fabs, Mainstream Technology Business, TSMC |
J. K. Wang received his B.S. and M.S. degrees in chemical engineering from National Cheng-Kung University in 1981 and 1983 respectively. He is currently Vice President of Operations for 300mm fabs. Prior to this post, he was the senior director of 300mm fab operations.
J. K. Wang has served at TSMC since the company was founded in 1987. During his career with TSMC, he has been involved in many different aspects of the company's operations, including module engineering, process integration, R&D technology development, manufacturing, and fab management. Previously, he had been the fab director of Fab4, Fab3, Fab14 and senior director of 6" and 8" fab operations.
J. K. Wang has been deeply involved in building up TSMC's manufacturing technology and systems, particularly fab automation and manufacturing infrastructure. He currently serves as TSMC's representative on the International SEMATECH Manufacturing Initiative (ISMI) Executive Advisory Committee for next generation fabs. |
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| アイリーン・サン |
バイス・プレジデント
コーポレートプランニング担当 |
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Education:
Ph.D., Materials Science and Engineering, Cornell University, USA
Experience:
Senior Director, Corporate Planning Organization, TSMC
General Manager, Technology Group, IBM Taiwan |
Dr. Irene Sun is currently TSMC's Vice President Corporate Planning. Prior to this post, she was Senior Director of the Corporate Planning Organization. She joined TSMC in October 2003 as Director of the Corporate Pricing Division.
Prior to TSMC, Dr. Sun worked at IBM for 23 years and held a variety of management positions in R&D, Manufacturing Engineering, Marketing & Sales, and Business Management.
Dr. Sun received her B.S. degree in Nuclear Engineering from National Tsinghua University in Taiwan, and her Ph.D. in Materials Science and Engineering from Cornell University. |
Education:
Ph.D. Electrical Engineering, Ohio State University, USA
Experience:
Senior director, Nanopatterning Technology Division,TSMC
President, Linnovation, Inc. USA
Department manager, IBM USA |
Dr. Burn J. Lin joined TSMC in 2000. His TSMC teams support R&D on mask fabrication, lithography tooling and processing for advanced CMOS logic and memory nodes, as well as Optical Proximity Correction (OPC), Design for Manufacturing (DFM), Resolution Enhancement Techniques (RET), and Next Generation Lithography (NGL). They have successfully transferred the 130-, 90-, 65-, and 40-nm nodes as well as subnodes to manufacturing. He founded Linnovation, Inc. in 1992. Prior to that, he held various technical and managerial positions in the field of microlithography at IBM. He has been extending the limit of optical lithography for close to four decades. His most recent achievement is to pioneer extension of optical lithography with water immersion.
Dr. Lin is the editor in chief of the Journal of Micro/nanolithography, MEMS, and MOEMS, a fellow of IEEE and of SPIE, and a member of the US National Academy of Engineering. |
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| ワイジェイー・ミー |
バイス・プレジデント
R&D担当 |
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Education:
Ph.D., Electrical Engineering, University of California, Los Angeles, USA
Experience:
Senior Director of R&D Platform I Division, TSMC
Fab 3 Deputy Director, TSMC
Research Staff Member, R&D, IBM |
Dr. Y.J. Mii became TSMC's Vice President of Research and Development (R&D) in 2011. He joined TSMC in 1994 and has been involved continuously in the development and manufacturing of advanced CMOS technologies in both Fab Operation and R&D. Dr. Mii joined R&D in 2001, managing both 90nm and 40nm technology development. Following that he began supervising 28nm technology development, accelerating it to lead the foundry industry.
Dr. Mii was a research staff member of IBM Research before joining TSMC. He joined TSMC as a deputy manager of Fab 3 engineering, eventually rising to a senior director of R&D before being promoted.
He holds a B.S. in electrical engineering from National Taiwan University; and an M.S. and Ph.D. in Electrical Engineering from the University of California, Los Angeles (UCLA). |
Education:
Ph.D., Electrical and Computer Engineering, Syracuse University, USA
Experience:
Senior Director, Design and Technology Platform, TSMC
Section Manager, ITRI/CCL, Taiwan |
Dr. Cliff Hou was appointed TSMC's Vice President of Research and Development (R&D) in 2011. He joined TSMC in 1997. He was previously Senior Director at Design and Technology Platform where he established the Company's technology design kit and reference flow development organizations. He also led TSMC in-house IP development teams from 2008 to 2010.
Before TSMC he was in front-end design environment development with Taiwan's national telecommunications laboratory, ITRI/CCL; worked as a consultant specializing in physical verification methodologies; and served as an Associate Professor at Kaohsiung Polytechnic Institute, Taiwan.
Dr. Hou holds 20 U.S. Patents and serves as a board member of Global Unichip Corp. He received his B.S. degree in control engineering from Taiwan's National Chiao-Tung University, and Ph.D. in electrical and computer engineering from Syracuse University. |
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| 海外支社担当役員 |
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| リック・キャッシディー |
バイス・プレジデント
TSMCノースアメリカ プレジデント |
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Education:
B.A. Science degree in Engineering, United States Military Academy at West Point, USA
Experience:
Vice President of TSMC North America Account Management |
Rick Cassidy, Vice President of TSMC and President of TSMC North America, is a 25-year plus veteran of the semiconductor industry. Rick joined TSMC in 1997 and became president in 2005. During his tenure, he has seen the company's revenues grow to $9 billion in 2009. Rick also has been integral to the growth of the Global Semiconductor Alliance, where he is currently is a board member.
Prior to joining TSMC, Rick spent 18 years at National Semiconductor holding positions in engineering, manufacturing, operations, marketing and, ultimately, as vice president and general manager of the military and aerospace division.
Rick earned a Bachelor of Science and Engineering degree from the United States Military Academy at West Point and served as an officer in the United States Army. |
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| マリア・マーセド |
| TSMCヨーロッパ プレジデント |
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Education:
Ph.D., Telecommunications Engineering, Universidad Politecnica de Madrid, Spain
Experience:
Senior Vice President and General Manager, Sales and Marketing, NXP Semiconductors/Philips Semiconductors |
Education:
MBA, Willamette University, USA
Experience:
Vice President, TSMC Japan |
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| シーエイチ・チェン |
| TSMCチャイナ プレジデント |
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Education:
Master, Opto-electronic Engineering, National Chiao-Tung University, Taiwan
Experience:
Fab Director of Fab3, Fab7 of TSMC, Operation Vice President of SSMC |
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