 |
台积公司通过位于各地的晶圆厂以及办事处，为全球半导体客户提供服务，全球总部以及晶圆二厂、三厂、五厂、八厂及十二厂皆位于台湾新竹科学园区；晶圆六厂及十四厂则位于台南科学园区，而十五厂则位于中部科学工业园区。台积公司共拥有三座先进的十二吋晶圆厂、四座八吋晶圆厂以及一座六吋晶圆厂，此外，有来自转投资子公司WaferTech公司(美国)以及TSMC中国有限公司以及新加坡合资SSMC公司充沛的产能支持。身为全球首创专业集成电路制造服务公司，台积公司提供业界卓越的制程技术、通过制程验证的组件数据库、硅知识产权，以及其它领先的专业集成电路制造服务，例如光罩制作服务以及封装与测试服务。台积公司所提供的制程技术包括CMOS logic, mixed-mode/RF, volatile and non-volatile memory, BiCMOS, High Voltage and CMOS Image Sensor等。 |
 |
| Fab Locations |
TSMC's corporate headquarters, and fab 2, 3, 5, 8 and 12 are located in the Hsinchu Science Park. Fab 6 and 14 are located... |
|
| 300mm Wafer |
| TSMC currently operates three 300-mm GIGAFAB™ facilities (Fabs 12, 14 and Fab 15). With a combined capacity of ... |
|
| Fab Capacity |
| Total capacity of the manufacturing facilities managed by TSMC, including subsidiaries and joint ventures, is expected to ... |
|
| Efficiency |
| Fast yield ramp help TSMC shorten customers'time-to-market. TSMC has developed a comprehensive... |
|
| GIGAFAB™ |
| TSMC's 12-inch fabs are a key part of its manufacturing strategy. TSMC currently operates three 12-inch GIGAFAB™... |
|
|
|
