The complexity of advanced technologies drives new requirements for poly/OD and metal fill to solve critical manufacturing effects, and more importantly design yields. New methodologies were developed for 28nm designs using Calibre SmartFill to meet the new strict DFM requirements while reducing run time, file size and iterations.
Besides manufacturing process, electrical rule checks can also significantly impact design yields & reliability. Identifying incorrectly configured devices, multi-power domain transition guides, and floating (leaky) gates is critically important right from the circuit stage, well before physical layouts. Such early design consistency checks written with rules in Calibre® PERC™ help us catch design mistakes early on, and validate some of our high reliability design metrics.
Both Calibre Smart-Fill and Calibre® PERC™ were significantly and successfully deployed on Broadcom's largest 28nm tapeout recently, which the Broadcom representative will describe in the presentation.
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