Hsin-chu, Taiwan, R.O.C. – April, 20, 2009 - Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330, NYSE: TSM) today unveiled the first foundry-specific Integrated Sign-Off Flow at its North American Technology Symposium in San Jose, CA. The new flow is available now for 65nm designs.
Integrated Sign-Off Flow is an automated RTL to GDSII chip implementation flow that tightly integrates all process-specific items including pre-qualified library and IP, selected EDA tools, production-quality flow, advanced design methodology, and TSMC foundry technology files that have been proven and refined over hundreds of applications. With embedded TSMC design know-how and sign-off recommendations, the new flow utilizes pre-qualified EDA toolsets from multiple vendors and leverages industry-proven TSMC Reference Flow methodology.