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TSMC Reports Impact From March 4 Earthquake
Initial Estimate of 1.5 Days Wafer Movement Loss
Issued by: TSMC
Issued on: 2010/03/04
Hsinchu, Taiwan, R.O.C. ¡V March 4, 2010 ¡V TSMC (TWSE: 2330, NYSE: TSM) today announced that an earthquake of magnitude 6.4 on the Richter scale occurred in south Taiwan at 8:18 am Taiwan local time on March 4. The earthquake registered on instruments at TSMC's Tainan site at magnitude 5, and was measured at TSMC¡¦s Hsinchu site at magnitude 2.

Current assessments reports show that the earthquake had minimal impact on Hsinchu fabs. While Tainan fabs suffered greater impact, they have gradually begun to resume production. Our initial estimate is that the earthquake caused the equivalent of 1.5 days loss of wafer movement for the company in total.

TSMC Spokesperson
Lora Ho
Senior Vice President & Chief Financial Officer & Spokesperson
Tel: 886-3-5664602
TSMC Deputy Spokesperson
Dr. Elizabeth Sun
Director, TSMC Corporate Communication Division
Tel: 886-3-5682085
Email: elizabeth_sun@tsmc.com