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TSMC Board of Directors Resolutions
Issued by: TSMC
Issued on: 2009/11/10
Hsinchu, Taiwan, R.O.C., November 10, 2009 ¡VTSMC (NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions:

1. Approved capital appropriations of US$2,240.8 million to expand advanced technology capacity for twelve-inch wafer fabs, and increase twelve-inch capacity for wafer level chip scale packaging process.

2. Approved capital appropriations of US$254.6 million to expand 12-inch wafer fab facilities.

3. Approved capital appropriations of US$46 million to set up a production line and product development lab for solid state lighting.

4. Appointed Dr. Jack Sun as Chief Technology Officer of TSMC, in charge of formulating TSMC¡¦s technology strategy and conducting the development of the company¡¦s most advanced technologies. Dr. Sun will report directly to Dr. S.Y. Chiang, Senior Vice President of Research and Development.

TSMC Spokesperson
Lora Ho
Vice President & Chief Financial Officer & Spokesperson
Tel: 886-3-5664602
TSMC Deputy Spokesperson
J.H. Tzeng
Deputy Director, PR Department
Tel: 886-3-5055028
Fax: 886-3-5670121
Mobile: 886-928-882-607
Email: jhtzeng@tsmc.com
For further information, please contact
Richard Chung
Technical Manager
Tel: 886-3-563-6688 ext. 712-5038
Fax: 886-3-5670121
Mobile: 886-911-258-751
Email: cychung@tsmc.com