1. Approved capital appropriations of US$2,240.8 million to expand advanced technology capacity for twelve-inch wafer fabs, and increase twelve-inch capacity for wafer level chip scale packaging process.

2. Approved capital appropriations of US$254.6 million to expand 12-inch wafer fab facilities.

3. Approved capital appropriations of US$46 million to set up a production line and product development lab for solid state lighting.

4. Appointed Dr. Jack Sun as Chief Technology Officer of TSMC, in charge of formulating TSMC¡¦s technology strategy and conducting the development of the company¡¦s most advanced technologies. Dr. Sun will report directly to Dr. S.Y. Chiang, Senior Vice President of Research and Development.