晶圓級系統整合

With the proliferation of AI and 5G from cloud data center to network router to edge applications, according to IDC 2017, the global data traffic will grow from 16 ZB in 2016 to 163 ZB in 2026, a 10X growth in 10 years. Data processing with fast speed and low power consumption becomes common pursuits in all applications. The innovations in system integration has become a key dimension and is accelerating to keep pace with the insatiable demands for data bandwidth, computing speed, and computing efficiency.

TSMC Wafer Level System Integration (WLSI) is leading the semiconductor industry into a new era of system scaling that goes beyond the scope defined by Moore's Law. Innovative 3DIC technology platforms, such as CoWoS® (Chip on Wafer on Substrate), InFO (Integrated Fan Out), and SoIC (System on Integrated Chips) enable innovation through chiplet partitioning and systems integration that achieves greater functionality and enhanced system performance at increasingly competitive costs.

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感謝您造訪台積電晶圓級系統整合技術平台,我是Doug Yu(余振華),很榮幸能擔任今日的主持人。

大家都知道現在每一代晶片微縮的挑戰性越來越高,維持摩爾定律或電晶體微縮相當令人期盼、嚮往。於此同時,也需要晶片的異質整合實現所謂的超越摩爾應用。這些挑戰變得越來越嚴峻,卻也提供令人振奮的創新機會。

台積電一直致力於克服這些挑戰,本人很高興向各位介紹台積電創新的WLSI技術平台,此為業界首創晶圓級系統整合技術平台。

為什麼台積電選擇晶圓級系統整合,而非傳統封裝中的面板級系統整合?這部分有若干重要考量。

首先,晶圓級系統整合可實現前端晶圓製程及後端晶片封裝的無縫整合,提供相當大的價值,這部分稍後將做更詳細的說明。台積電掌握先進晶圓製造及先進晶圓級系統整合全方位的優勢,得以實現業界首創系統整合技術代工服務,促進5G、AI、物聯網及自駕時代的系統創新。

其次,晶圓級系統整合充分善用台積電在銅導線技術、量產產能、良率學習與品質保證等晶圓製程專長技術。這項獨特的價值讓更先進系統應用在系統效能、功耗、微型化與及時上市量產形成徹底差異化優勢。

第三,它充分利用台積電全方位的IC設計生態系統,從IC設計支援發展至系統設計支援的及時協同設計。

目前台積電的創新晶圓級系統整合技術平台結合CoWoS、InFO和SoIC三技術平台。各式產品組合持續在水平尺寸增長及垂直晶片堆疊發展,除滿足前述現有市場需求,亦可符合長期市場的各種應用需求。

再一次,歡迎您造訪台積電網站,瀏覽我們在WLSI技術平台所提供的各項先進技術的資訊。

Intro to Wafer Level System Integration Technologies

Dr. Doug Yu introduces TSMC's industry-leading wafer level system integration technologies and explains how the innovative wafer-form approach paves the way for the new era of heterogeneous integration.
WLSI Platform's Complete System Integration Portfolio
CoWoS

Best in breed performance for high performance computing applications

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InFO

Best cost/performance for high density, high performance mobile, network applications

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SoIC

Chiplets stacking with exceptional performance, form factor, and power saving

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