TSMC provides foundry's most advanced and comprehensive portfolio of Mixed Signal/RF CMOS (MS/RF) technology. TSMC and its customers jointly unleash a number of innovations in the MS/RF segment and account for a 75% share of this market. TSMC MS/RF technology supports multiple communication applications, including smartphones, wireless, Bluetooth, and others.
16FFC RF led the foundry to start volume production of the fifth generation (5G) mobile network chips for customers in the first half of 2018. This technology has been extended to the next generation Wireless Local Area Network (WLAN 802.11ax) and Millimeter Wave (mmWave) applications, as well as to wireless connectivity applications such as smartphones using the 5G mobile network. As TSMC continues to advance 16FFC RF technology, this more cost-effective technology will be used in more applications such as radar and AR/VR, to reduce chip power consumption and die size.
Meanwhile, 22nm RF (22ULP/ULL RF) technology extended its support for ultra-low leakage devices, magnetic random access memory (MRAM), and resistive random access memory (RRAM) in 2018, in addition to high fT (cut-off frequency) devices. This further supports chip development for 5G mm Wave mobile communication and IoT applications.
In addition, 28nm RF (28HPC+ RF) technology delivered the foundry's first RF process design kit (PDK) in 2018, providing support for 110GHz mmWave and 150°C automotive grade and so on for 5G mmWave RF and automotive radar product designs.