獲獎名單：

共6名，以姓氏筆畫排序

姓名	學校
王瑀婕	清華大學
江宇森	台灣大學
陳信佑	清華大學
黃柏崴	台灣大學
黃耀弘	清華大學
蔡喻至	清華大學

獎助內容：

1. 博士修業期間每年獎助新台幣 50 萬元整，至多獎助五年。
2. 台積業師：由台積資深主管擔任業師，協助了解產業、技術發展階段與挑戰。
3. 帶薪實習：在學期間安排至台積實習。
4. 畢業後經審核將優先任用，表現優異者享有差異化待遇。

 

申請資格：

1. 國內大學半導體領域相關科系，預計於 2020 年九月至 2021 年一月間申請攻讀博士學位並於領獎時具博士生學籍之學、碩士班學生，規劃從事半導體相關領域研究(如下)，並經指導教授推薦申請者。

2. 研究領域

1. Semiconductor devices – device development, electrical characterization methodology & physics, and TCAD
2. Semiconductor processes, material science, and modeling - plasma physics, surface chemistry reaction, selective deposition on dielectric/conductor, electro-chemistry, atomic-layer deposition/etch, organic/in-organic chemistry synthesis, physical chemistry, lithography, e-beam, chemical vapor deposition, physical vapor deposition, and vacuum system
3. Exotic devices & materials – spintronics, magnetism, two-dimensional (2D) materials
4. Compact modeling about semiconductor electrical/magnetic devices, interconnection, radio-frequency mmWave, three-dimensional IC (3DIC), microelectromechanical system (MEMS) and bio-sensor
5. Algorithm development for model extraction/characterization or methodology for new applications of SPICE simulation
6. First-principles modeling of material characteristics (electrical, magnetics, etc.), material design and synthesis for nano-scale fabrication
7. Electronic design automation (EDA) and methodology, focusing on tool/methodology for future design-technology co-optimization (DTCO)
8. Next-generation design architectures including: three-dimensional IC (3DIC), power distribution network, standard cells, memory, input/output (IO), etc
9. Other semiconductor-related topics