獲獎名單:
共6名,以姓氏筆畫排序
姓名 |
學校 |
---|
王瑀婕 |
清華大學 |
江宇森 |
台灣大學 |
陳信佑 |
清華大學 |
黃柏崴 |
台灣大學 |
黃耀弘 |
清華大學 |
蔡喻至 |
清華大學 |
獎助內容:
- 博士修業期間每年獎助新台幣 50 萬元整,至多獎助五年。
- 台積業師:由台積資深主管擔任業師,協助了解產業、技術發展階段與挑戰。
- 帶薪實習:在學期間安排至台積實習。
- 畢業後經審核將優先任用,表現優異者享有差異化待遇。
申請資格:
1. 國內大學半導體領域相關科系,預計於 2020 年九月至 2021 年一月間申請攻讀博士學位並於領獎時具博士生學籍之學、碩士班學生,規劃從事半導體相關領域研究(如下),並經指導教授推薦申請者。
2. 研究領域
- Semiconductor devices – device development, electrical characterization methodology & physics, and TCAD
- Semiconductor processes, material science, and modeling - plasma physics, surface chemistry reaction, selective deposition on dielectric/conductor, electro-chemistry, atomic-layer deposition/etch, organic/in-organic chemistry synthesis,
physical chemistry, lithography, e-beam, chemical vapor deposition, physical vapor deposition, and vacuum system
- Exotic devices & materials – spintronics, magnetism, two-dimensional (2D) materials
- Compact modeling about semiconductor electrical/magnetic devices, interconnection, radio-frequency mmWave, three-dimensional IC (3DIC), microelectromechanical system (MEMS) and bio-sensor
- Algorithm development for model extraction/characterization or methodology for new applications of SPICE simulation
- First-principles modeling of material characteristics (electrical, magnetics, etc.), material design and synthesis for nano-scale fabrication
- Electronic design automation (EDA) and methodology, focusing on tool/methodology for future design-technology co-optimization (DTCO)
- Next-generation design architectures including: three-dimensional IC (3DIC), power distribution network, standard cells, memory, input/output (IO), etc
- Other semiconductor-related topics