Shorter wavelength of EUV light is better to print the nanometer-scale features of advanced technology designs, which is one of the key factors to keep driving chip scaling. (Photo courtesy of ASML)
Shorter wavelength of EUV light is better to print the nanometer-scale features of advanced technology designs, which is one of the key factors to keep driving chip scaling. (Photo courtesy of ASML)

TSMC N7+ EUV Process Technology Leads the World

Accelerate Customer Product Deliveries to Market in High Volume to Improve and Enrich Human Life
Richard Chung

The rapid growth of 5G and Artificial Intelligence (AI) drives the need for IC products with higher performance, lower power consumption and a greater degree of system integration. To address customers’ needs, TSMC continues its investments in technology research and development to provide the most advanced and the broadest technology portfolios. Together with our customers, TSMC hopes to bring the world a brand new 5G experience and revolutionary AI applications to improve and enrich our lives.

In 2019, TSMC led the world to accelerate customers’ advanced products design and delivery in high volume with TSMC’s industry-leading 7nm Plus (N7+) EUV technology. The success in EUV volume production is another great example of how TSMC not only makes those leading-edge customer designs possible, but also accelerates their deliveries in high volume with our manufacturing excellence.

TSMC N7+ EUV Technology Highlights

TSMC Leads Foundry to Start Volume Production of EUV Technology

EUV technology is one of the key factors that enable TSMC to keep driving chip scaling as the shorter wavelength of EUV light is better able to print the nanometer-scale features of advanced technology designs. EUV tools installed at TSMC have reached production maturity, with tool availability reaching target goals for high-volume production, and output power of greater than 250 watts for day-to-day operations.

Building on its successful experience, N7+ builds a solid foundation for TSMC’s 6nm (N6) and more advanced process technologies. The risk production of N6 is scheduled to begin in the first quarter of 2020, and its volume production is expected to start before the end of the year. With further application of EUV, N6 offers 18% higher logic density over N7. In addition, its design rules are compatible with N7, which enables customers to greatly shorten time-to-market and enhance its competiveness in the market.