Founded on February 21, 1987, and headquartered in Hsinchu, Taiwan, TSMC pioneered the foundry business model by focusing solely on manufacturing customers’ semiconductor designs. As a pure-play semiconductor foundry, the Company does not design, manufacture, or market semiconductor products under its own brand name, ensuring that TSMC does not compete directly with its customers. Today, TSMC is the world’s largest pure-play semiconductor foundry, manufacturing 8,876 different products using 210 different technologies for 453 different customers in 2014.
With a diverse global customer base, TSMC-manufactured semiconductors are used in a wide variety of applications covering various segments of the computer, communications, consumer, industrial and standard semiconductor markets.
Annual capacity of the manufacturing facilities managed by TSMC and its subsidiaries totaled 8.18 million 12-inch equivalent wafers in 2014. TSMC’s managed manufacturing facilities include three 12-inch wafer GIGAFAB™ facilities, four 8-inch wafer fabs, and one 6-inch wafer fab in Taiwan, as well as two 8-inch wafer fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited.
TSMC provides customer service through its account management and engineering services offices in North America, Europe, Japan, China, South Korea, and India. The Company employed more than 43,000 people worldwide at the end of 2014.
By leveraging the successful mass production of 28nm, including 28HP, 28HPM, 28HPL and 28LP, TSMC continuously delivered a highly competitive performance/cost solution 28HPC (High Performance Compact) in 2014. This process is seamlessly applicable to the 28nm ecosystem, accelerating time-to-market for customers. Furthermore, 20nm System-on-Chip technology (20SoC) entered the production stage with smooth ramping and stable yield performance. By introducing the advanced patterning technique, this process provides better density and power value for both performance-driven products and mobile computing applications migration. In addition, 16nm FinFET Plus (16FF+) process passed full reliability qualification on schedule in the fourth quarter of 2014, and nearly 60 customer designs are currently scheduled for tape-out by the end of 2015. Due to rapid progress in yield and performance, 16FF+ volume ramp is expected to begin around July in 2015. TSMC’s comprehensive 16FF+ design ecosystem supports a wide variety of EDA tools and hundreds of process design kits with more than 100 IPs, and all have been silicon validated. Also, 10nm technology is under development and on track to start risk production in the fourth quarter of 2015. The Company anticipates customer tape-out in the fourth quarter of 2015 and volume production in 2016. In addition to general-purpose logic process technology, TSMC supports the wide-ranging needs of its customers with embedded non-volatile memory, embedded DRAM, Mixed Signal/RF, high voltage, CMOS image sensor, MEMS, silicon germanium technologies and automotive service packages.
TSMC’s subsidiaries TSMC Solid State Lighting Ltd. and TSMC Solar Ltd. engage in researching, developing, designing, manufacturing and selling solid state lighting devices and related products and systems, and solar-related technologies and products, respectively. In January 2015, TSMC announced a sale of all TSMC SSL shares held by TSMC and TSMC’s subsidiary to Epistar Corp. After this transaction, TSMC completely exited TSMC SSL.
The Company is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol “TSM”.