In addition to wafer manufacturing services, TSMC provides a wide range of backend services. Take advantage of TSMC's diversified and streamlined one-stop services that include:
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Wafer Bumping Services
TSMC offers various leading edge wafer bumping processes...
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Wafer Level Chip Scale Package Services
TSMC's WLCSP portfolio meets the growing demand for fully integrated assembly and test solutions...
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CoWoS®(Chip-on-Wafer-on-Substrate) Services
TSMC's innovative CoWoS® advanced packaging technology integrates logic computing and memory chips...
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InFO (Integrated Fan-Out) Services
TSMC's industry-leading Integrated Fan-Out (InFO) advanced packaging technology offers the most competitive size, radiation protection, costs...
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Testing Services
TSMC began providing testing services in the late 1980's and, over time, has expanded its services to cover not only memory, logic and mixed-mode...
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Integrated Backend Services
TSMC helps customers manage their entire supply chain, from silicon wafer processing, bumping, wafer sort...
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SoIC®
TSMC's industry-leading TSMC-SoIC® is an innovative frontend wafer-process-based platform that integrates...
