Home > Dedicated IC Foundry > Services > Advanced Packaging & Services > Integrated Backend Services
Integrated Backend Services    
Design Services
Mask Services
Advanced Packaging & Services
Wafer Bumping Services
Wafer Level Chip Scale Package Services
CoWoS® (Chip-on-Wafer-on-Substrate) Services
InFO (Integrated Fan-Out) Services
Testing Services
Integrated Backend Services
Open Innovation Platform®
Grand Alliance
In addition to in-house CoWoS and InFO services, TSMC also offers integrated turnkey services to its customers by managing the entire supply chain via outsourced assembly and test partners. The service includes silicon wafer fabrication, wafer bumping, wafer sort, assembly, final test, and shipping. Such comprehensive service helps customers achieve shorter time-to-market and time-to-volume.

TSMC Reports Second Quarter EPS of NT$2.57(2019/07/18)
TSMC June 2019 Revenue Report(2019/07/10)
Media Contacts

Open Innovation Platform®
Tech Symposiums, Trade Shows, Industry Events & Investor Meetings
TSMC Value Chain Aggregator
Business Contacts
Document Center
TSMC-Onlinenew window
Online information and transaction for our customers.

The web-based portal for smarter supplier interactions.
Find more information about TSMC.
Open Innovation Platform® Home     Contact Us     Site Map     FAQ     Legal Notice & Trademark Information     Privacy & Cookies Policy
Copyright© Taiwan Semiconductor Manufacturing Company Limited 2010-2019, All Rights Reserved.