TSMC's industry-leading TSMC-SoIC® is an innovative frontend wafer-process-based platform that integrates multi-chip, multi-tier, multi-function and mix-and-match technologies to enable high speed, high bandwidth, low power, high pitch density, and minimal footprint and stack-height heterogeneous 3D IC integration. This technology not only helps to sustain Moore's Law regarding chip partition and on-chip integration, but also enables off-chip heterogeneous system-level scaling.

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