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CoWoS® (Chip-on-Wafer-on-Substrate) Services
InFO (Integrated Fan-Out) Services
Testing Services
Integrated Backend Services
Open Innovation Platform®
Grand Alliance
TSMC provide integrated service include test program development , probe card design and manufacturing to support new product introduction time to market through fast yield learn cycle. Also support the product production ramping on mainstream test platform to provide the capacity, quality and fast cycle time.

Program Development
Program Conversion
Program Optimization
Program Correlation
Tester interface (Probe Card & interface board) Design
Probe Card Manufacturing
Probe Card Solutions
Probe Card Maintenance
Remote Testing
Test Time Reduction
Low Yield Analysis
Tester Model (Uflex, 93K, J750) Selection
8-inch and 12-inch Wafer Probing
Final Test

TSMC Reports Second Quarter EPS of NT$2.57(2019/07/18)
TSMC June 2019 Revenue Report(2019/07/10)
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